
SECTION 1: INTRODUCTION
Content |
| Page | |
GENERAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . | |||
PURPOSE AND SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . | |||
| PatchSwitch Assembly Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . | ||
| PatchSwitch Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . | ||
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . | |||
|
_________________________________________________________________________________________________________
1 GENERAL
ADC PatchSwitch Digital Patching with
232)or CCITT V.24, X.21, or V.35 circuits for patching or switching to allow monitoring, testing, and reconfiguring of a communications network. The V.35 description is located in Section 3. The X.21 description is located in Section 4.
Note: The PatchSwitch equipment described in this manual conforms to EIA/CCITT (RS- 232/Recommendation V.24), interface between Data Terminal Equipment (DTE) and Data Communication Equipment (DCE) known as the Serial Binary Data Interchange or SBDI.
The PatchSwitch product line is a flexible, modular system providing the following features:
1.Monitoring of digital communications leads without circuit interruption;
2.Line access and switching on data communications circuit directed toward two (A/B) equipments at the DTE end and as directed toward the modem at the DCE end;
3.Loss of monitored signal alarming circuits which identify the down circuit with either or both visual and audible indications;
4.Optional signal monitoring and alarming of eight different
5.Optional interlocking in groups of two to 16 modules with A/B switching;
6.Optional interlocking in groups of two to 16 chassis with A/B switching;
7.Optional test module with three (3)
8.Flexibility of the modular system approach allows the addition of chassis and modules and the interchange of modules on a single line basis;
9.Module replacement or removal with no need for rear cable disconnection;
10.All female DTE and DCE connectors or female DTE and male DCE connectors;
11.High density chassis occupies 7 inches (17.78 cm) in height within a standard
Page
© 1999, ADC Telecommunications, Inc.