Fanless Design–Heat-pipe 
The ASUS fanless design allows multi-directional heat flow from major thermal sources in the motherboard to lower overall system temperature, resulting in quieter operation and longer system life. ASUS has devoted special efforts to address the thermal issues across the motherboard, and most notably in the following areas: CPU, power, VGA, Northbridge and Southbridge. The heat pipe, heatsink, and strategic board layout were tailor made to dissipate heat in the most efficient manner.
Fanless Design–Stack Cool 2 
ASUS Stack Cool 2 is a fan-less and zero-noise cooling solution that lowers the temperature of critical heat generating components. The motherboard uses a special design on the printed circuit board (PCB) to dissipate heat these critical components generate.
1.3.4ASUS special features
AI Gear 3 
With a manual or automatic mode, AI Gear 3 allows users to choose from four profiles to adjust CPU frequency and vCore voltage—“Turbo Mode,” “High Performance Mode,” “Medium Power Saving Mode,” and “Max Power Saving Mode.” As a digital solution, AI Gear 3 is very precise and can automatically detect current CPU loading, dynamically overclocking the CPU speed in real time and lowering the voltage for power saving during light loading. With this power saving mode, users can make real-time changes in the operating system and can save up to 62% CPU power in light loading. See page 5-29 for details.
AI Nap 
With AI Nap, the system can continue running at minimum power and noise when you are temporarily away. To wake the system and return to the OS environment, simply click the mouse or press a key. See page 5-30 for details.
ASUS Q-Fan 2 
ASUS Q-Fan 2 technology intelligently adjusts both CPU fan and chassis fan speeds according to system loading to ensure quiet, cool and efficient operation. See pages 4-31, 4-32, and 5-31 for details.
ROG Maximus Formula (Special Edition) / Maximus Formula | 1- |