Support Hardware for F2MC-16L Family

 

 

Development Tools

 

Equipment for program to OTP/EPROM

 

 

 

 

 

 

 

Microcontro

 

IC Package

Target

Yokogawa Digital Computer ICE

 

ller subject

 

Microcontroller

Evaluation

EPROM

Conversion Adapter

 

 

 

 

 

Program

 

 

 

 

 

 

device

programmer

(for program to OTP/

 

 

 

Conversion

 

 

Product

 

Pod

 

 

Main unit, Other

 

 

EPROM)

Product name

 

Adapter

 

 

name

 

 

 

 

 

 

 

 

 

PF455

 

QF455

 

 

MB90V610A

 

MB90611A

 

 

 

 

 

 

 

PF455

 

 

 

(PGA-256C)

 

 

MB90613A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MB90V620A

MB90P623A

 

 

MB90622A

PF453

 

 

 

 

ROM-100SQF-32DP-16L

MB90623A

 

 

 

(PGA-256C)

 

 

 

 

 

 

 

 

 

MB90P623A

 

 

 

 

 

 

 

 

 

PF452

 

QF452

 

 

MB90V630A

 

 

ROM-100QF-32DP-16L

MB90632A

 

 

 

 

 

MB90P634A

 

 

MB90634A

 

 

 

 

 

(PGA-256C)

 

 

PF452

 

 

 

 

 

ROM-100SQF-32DP-16L

MB90P634A

 

 

 

 

 

 

 

 

 

 

• advice

 

 

 

 

 

 

 

 

 

 

 

 

ROM-100QF-32DP-

 

PF456

 

QF456

 

(main unit) :

MB90V640A

 

 

MB90641A

 

 

 

 

AD200

MB90P641A

 

FMC16F

PF456

 

 

• Dummy target

(PGA-256C)

General-pur-

ROM-100SQF-32DP-

MB90P641A

 

 

 

 

 

 

 

FMC16F

 

 

 

 

 

(option) : /DUT

 

 

pose EPROM

 

 

 

 

 

 

 

Programmer

 

MB90652A

 

 

 

 

 

 

 

 

PF457

 

QF457

 

• Evaluation chip

 

 

(capable of

ROM-100QF-32DP-16L

 

 

 

 

MB90653A

 

 

 

 

MB90V650A

 

Programming

 

 

 

 

 

: attached

(PGA-256C)

MB90P653A

to

 

MB90P653A

PF457

 

 

• Emulator

 

 

MBM27C1000)

ROM-100SQF-32DP-16L

MB90654A

 

 

 

 

 

 

 

 

MB90F654A

 

 

 

 

debugger soft-

 

 

 

 

 

PF454

 

 

ware :

 

 

 

ROM-64QF-32DP-16L

MB90662A

 

 

 

 

micro VIEW-G

MB90V660A

 

 

 

 

 

 

 

MB90P663A

 

 

MB90663A

 

 

 

 

 

(PGA-256C)

 

 

PF454

 

F454

 

 

 

 

ROM-64SD-32DP-16L

MB90P663A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PF450A

 

 

 

 

 

 

ROM-80QF-32DP-16L

MB90671

 

 

 

MB90V670

 

 

MB90672

 

 

 

 

 

MB90P673

 

 

 

 

 

 

 

 

 

MB90673

 

 

 

 

 

(PGA-256C)

 

 

PF450A

 

QF450

 

 

 

 

ROM-80SQF-32DP-16L

MB90T673

 

 

 

 

 

 

 

 

 

 

 

 

MB90P673

 

 

 

 

 

 

 

 

 

PF451

 

QF451

 

 

 

 

 

ROM-100QF-32DP-16L

MB90676

 

 

 

MB90V670

 

 

MB90677

 

 

 

 

 

MB90P678

 

 

 

 

 

 

 

 

 

MB90678

 

 

 

 

 

(PGA-256C)

 

 

PF451

 

 

 

 

 

ROM-100SQF-32DP-16L

MB90T678

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MB90P678

 

 

Sweden:

Bexab Electronics TEL(08)7680560

 

 

 

 

 

Switzerland: Slcovend AG TEL(01)8303161

 

 

 

• Asia

Singapore: Yamco Electronics Pte Ltd. TEL(336)6522

 

 

 

 

 

Korea:

Asia Yamaichi Electronics,Inc. TEL(02)482-7263

 

 

 

 

Taiwan:

Sing Way Co. TEL(02)718-5971

 

 

 

 

 

 

 

Joung Lai Trading Co. Ltd. TEL(02)754-1022

 

 

For IC sockets, it should be noted that there is a slight difference in footprint size between these and other mass-produced pack- ages. Therefore, caution is required in designing the footprint of the print board.

*5: TQPACK and NQPACK required for the connecting target of probe cable:

NQPACK064SB and HQPACK064SB140 (each provided) for QFP-64 (lead pitch: 0.65mm; body size: 12 ⋅ 12 mm)

TQPACK080SD and TQSOCKET080SDG (available separately) for LQFP-80 (lead pitch: 0.5 mm; body size: 12 ⋅ 12 mm)

NQPACK100RB and HQPACK100RB179 (each provided) for QFP-100 (lead pitch:0.65 mm; body size: 14 ⋅ 20 mm)

NQPACK100SD and HQPACK100SD (each provided) for LQFP-100 (lead pitch: 0.5mm; body size: 14 ⋅ 14 mm)

NQPACK120SD220 and HQPACK120SD226 (each provided) for QFP-120 (lead pitch:0.5 mm; body size: 20 ⋅ 20 mm)

TQPACK120/144SD and TQSOCKET120/144SDP (each provided) for QFP-120 (lead pitch: 0.5 mm; body size: 20 ⋅ 20 mm)

NQPACK120SD and HQPACK120SD (each provided) for QFP-120 (lead pitch: 0.5mm; body size: 16 ⋅ 16 mm)

NQPACK120SE and HQSOCKET120SE (provided) for LQFP-120 (lead pitch: 0.4 mm; body size: 14 ⋅ 14 mm)

Caution: For the TQPACK and NQPACK, it should be noted that there is a slight difference in footprint size between these and other mass-produced packages.

Therefore,caution is required in designing the footprint of the print board. Sales Info:

•USA: Daimaru New York Co. TEL(212)575-0820/0821 OESS Co. Head Office TEL(201)288-4422 OESS Co. Los Angeles Office TEL(714)220-1878 OESS Co. San Jose Office TEL(408)441-1855

•Europe Germany: OESS GmbH TEL(06106)75013

• Asia Hong Kong: Daimaru Kogyo,Ltd. Hong Kong Office TEL(852)8939457/8939108 Singapore: Daimaru Kogyo,Ltd. Singapore Office TEL(65)2251636

Hardware

-16L Family

Support

for F2MC

 

 

333