
Support Hardware for
Development Tools
| Target Microcontroller |
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| Fujitsu ICE | Yokogawa Digital Computer ICE | ||||
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Series name | Product name |
| Package | Probe |
| Main unit, other | Pod | Main unit, other | |
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| (0.5 mm, 14 ⋅ 14 mm) |
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| Not supported | Not supported | ||
| MB90867 *1 |
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| MB90867S *1 |
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MB90860 |
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MB90F867 |
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| MB90F867S |
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| (0.65 mm, 14 ⋅ 20 mm) |
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| Not supported | Not supported | ||
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| • Evaluation device : |
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| (separately available) |
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| MB90803 *1 |
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| • Emulator debugger soft- |
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MB90800 | MB90804 *2 |
| (0.65 mm, 14 ⋅ 20 mm) |
| ware : SOFTUNE | Not supported | Not supported | ||
| MB90F804 |
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| USB cable or |
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| MB90F897 *1 |
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| LAN cable |
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MB90890 |
| (0.5 mm, 7 ⋅ 7 mm) |
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| Not supported | Not supported | |||
MB90F897S *1 |
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Contact details for information on tool vender tools:Yokogawa Digital Computer Corporation; |
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Email: info@advice.ydc.co.jp | Website: http : //www.ydc.co.jp/advice |
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*1 : Under development |
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*2 : Being planned |
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*3 : The IC package conversion adapter provided by Sunhayato is required for connecting the probe cable (separately available).
Sales Info: Advanced Interconnectics http://advintcorp.com
*4 : The Yamaichi Electronics IC socket is always required for connecting each probe cable (separately available).
Sales Info:
•USA: Yamaichi Electronics Inc. TEL(408)4520797
•Europe Denmark: Wlmatok A.S. TEL(65)351446
England: | Radiatron Components Ltd. TEL(01)8911221 |
| AB Connector Ltd. TEL(0604)712000 |
Finland: | Dualtek Oy TEL(80)8019911 |
France: | |
Germany: | Macrotron AG TEL(089)4208148 |
| Glyn GmbH TEL:(49)61278077 |
| Connector Service GmbH TEL:(089)429277 |
Italy: | Eurosab International s.r.l TEL(02)93169781 |
Spain: | S.A Generalde Imporciones Electronicas |
Sweden: | Bexab Electronics TEL(08)7680560 |
Switzerland: | Slcovend AG TEL(01)8303161 |
• Asia Singapore: Yamco Electronics Pte Ltd. TEL(336)6522 | |
Korea: | Asia Yamaichi Electronics,Inc. |
Taiwan: | Sing Way Co. |
| Joung Lai Trading Co. Ltd. |
For IC sockets, it should be noted that there is a slight difference in footprint size between these and other
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