EM78P221/2N
8-Bit Microcontroller with OTP ROM
64 • Product Specification (V1.0) 10.19.2007
(This specification is subject to change without further notice)
C Quality Assurance and Reliability
Test Category Test Conditions Remarks
Solderability Solder temperature=245±5°C, for 5 seconds up to the
stopper using a rosin-type flux −
Step 1: TCT, 65°C (15 mins)~150°C (15 mins), 10 cycles
Step 2: Bake at 125°C, TD (endurance)=24 hrs
Step 3: Soak at 30°C/60% , TD (endurance)=192 hrs
Pre-condition Step 4: IR flow 3 cycles
(Pkg thickness: 2.5mm or
Pkg volume: 350mm3 ----225±5°C)
(Pkg thickness: 2.5mm or
Pkg volume: 350mm3 ----240±5°C)
For SMD IC (such as
SOP, QFP, SOJ, etc)
Temperature cycle test -65°C (15 mins) ~ 150°C (15 mins), 200 cycles −
Pressure cooker test TA =121°C, RH=100%, pressure=2 atm,
TD (endurance)= 96 hrs −
High temperature /
High humidity test TA=85°C, RH=85% , TD (endurance)=168, 500 hrs −
High-temperature
storage life TA=150°C, TD (endurance)=500, 1000 hrs −
High-temperature
operating life
TA=125°C, VCC=Max. Operating Voltage,
TD (endurance) =168, 500, 1000 hrs −
Latch-up TA=25°C, VCC=Max. operating voltage, 150mA/20V −
ESD (HBM) TA=25°C, ± 3KV
ESD (MM) TA=25°C, ± 300V
IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD,
IP_PS,OP_PS,IO_PS,
VDD-VSS(+),VDD_VS
S (-) mode
C.1 Address Trap Detect
An address trap detect is one of the MCU embedded fail-safe functions that detects
MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an
instruction from a certain section of ROM, an internal recovery circuit is auto started. If
a noise caused address error is detected, the MCU will repeat execution of the program
until the noise is eliminated. The MCU will then continue to execute the next program.