Intel 632xESB, 631xESB manual Contents

Contents—Intel®6321ESB ICH

Contents

1.0	Introduction		..............................................................................................................	5
	1.1	Design Flow		5
	1.2	Definition of Terms		7
	1.3	Reference Documents		7
2.0	Packaging Technology			9
3.0	Thermal Specifications			11
	3.1	Thermal Design Power (TDP)		11
	3.2	Die Case Temperature		11
4.0	Thermal Simulation			12
5.0	Thermal Solution Requirements			13
	5.1	Characterizing the Thermal Solution Requirement		13
6.0	Thermal Metrology			16
	6.1	Die Case Temperature Measurements		16
		6.1.1 Zero Degree Angle Attach Methodology		16
7.0	Reference Thermal Solution			19
	7.1	Operating Environment		19
	7.2	Heatsink Performance		19
	7.3	Mechanical Design Envelope		20
	7.4	Board-Level Components Keepout Dimensions		21
	7.5	Torsional Clip Heatsink Thermal Solution Assembly		22
		7.5.1	Heatsink Orientation	23
		7.5.2	Mechanical Interface Material	24
		7.5.3	Thermal Interface Material	24
		7.5.4	Heatsink Clip	25
		7.5.5	Clip Retention Anchors	25
8.0	Reliability Guidelines			26
A	Thermal Solution Component Suppliers			27
	A.1 Torsional Clip Heatsink Thermal Solution			27
B	Mechanical Drawings			28

Figures

1	Thermal Design Process	6
2	Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)	9
3	Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)	9
4	Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)	10
5	Processor Thermal Characterization Parameter Relationships	14
6	Thermal Solution Decision Flowchart	17
7	Zero Degree Angle Attach Heatsink Modifications	17
8	Zero Degree Angle Attach Methodology (Top View)	18
9	Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target
	at 65C Local-Ambient	20
10	Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub ....	21
11	Torsional Clip Heatsink Board Component Keepout	23
12	Torsional Clip Heatsink Assembly	24
13	Torsional Clip Heatsink Assembly Drawing	29
14	Torsional Clip Heatsink Drawing	30
	Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007		TMDG
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