NOTE: LincolnElectric assumes no responsibility for liablilities resulting from board level troubleshooting. PC Board repairs will invalidate your factory warranty. Individual PrintedCircuit Board Componentsare notavailable from LincolnElectric. Thisinformation is pro-
videdfor reference only. Lincoln Electric discourages board level troubleshooting and repair since it may compromise the quality of the design and may result in danger to the Machine Operator or Technician. Improper PC board repairs could result in damage to the
machine.
ELECTRICAL DIAGRAMS G-22
PC BOARD ASSEMBLY- INPUT PC BOARD
L11396-2
INVERTERWELDERS
INPUTP. C. BOARD ASSEMBLY
1:
1
L11396
-1
FEI
-
U
NLESS
OTHERW
ISE
SPE
C
IF
IE
D
TOLERA
N
CE
MANUFACTURIN
G
TOLERANCE PER
E2056
ON 2 PLACE DECIMA
LSIS± .02
ON3
PLAC
ED
E
CI
MAL
SI
S± .002
ONALL ANGLE
SIS±
.5OFA DEG
REE
WITH PUBLISHED STANDARDS.
MA
TERIA
LTO
LERANCE ("
")
TO AGREE
t
DON
OTS
CA
LE
TH
IS
D
RAW
ING
DRA
WN
B
Y:
DE
SI
GN INFORM
A
TION
E
NGIN
EE
R:
APPROVED:
REFERENCE:
EQU
IP
ME
NT
TYPE
:
SU
BJ
EC
T:
SCA
L
E:
L11396-2
MATERIAL
DISPOS
ITI
ON:
APPROVAL
DATE:
PROJECT
NUMBER:
UF
C
RM3440
9
1
PA
GE
___
OF
___
1
ENGINE
ERING CONTROL
L
ED
MANUFACTURER:
No
DOCUME
NT
N
UMB
E
R:
DOCUMENT
REVISION:
T
HIS
DOC
UME
N
TC
ON
TAINS P
R
OP
RIETA
RYIN
FO
RMATIO
N
OW
NE
DBY L
IN
C
OLN
GLOBAL, IN
C.A
N
DMAY NOT BE
D
UPLI
CA
TE
D,
C
OMMU
NI
CA
TE
D
TO OT
HE
RPA
R
TIES O
R
USE
D
FO
RA
NYP
U
RP
OSE WIT
HOU
TTHE E
X
PRESS
W
RITTE
NPE
RMISSIO
N
OF LIN
C
OLN
GLOBAL, IN
C.
PROPRI
ETA
RY& CONFIDE
NTIAL:
B
3/16/2
00
7
REVISE
DM
AKESPE
CIFI
C
ATIO
N
CHANGEDET
AI
L:
SOLIDEDGE
ST
RP
CAPACITORS= MFD / VOLTS
RESISTORS= OHMS/WATTS
N.A. THISAREA TO BE COVERED ON BOTH SIDES OF BO ARD WITH ITEM 2 PRIOR TO
ENCAPSULATION.MATERIAL MUST BE AP PLIED THRU SLOTS FROM BOTTOM
SIDE TO COMPLETELY FILL TO
UNDERSIDEOFDEVICE ON COMPONENT SIDE.
N.B. P.C.BOARDHOLES TO BE FREE OF ENCAPS ULATION MATERIAL.
N.C.
DONOT COAT WITH ENCAPSULATION MATERIAL.
N.D.
APPLYITEM 2 AS SHOWN, ALL EXPOSED LE ADS MUST BE COVERED. MATERIAL
MUST BE APPL
IEDPRIOR TO ENCAPSULATION.
N.E.
APPLY ITEM 2 ON N
ON
-COMPONENTSIDE OF BOARD PRIOR T O
ENCAPSULATION.
ALLEXPOSED PINS MUST BE COVER ED.
MAKEPER E1911-ROHS
ENCAPSULATEWITH E1844
TESTPER E3647-I
SCHEMATICREFERENCE: M19528-2B0
L11396-2
B0
IDENT
IFI
CATION
C
ODE
MA
NU
FA
CTURE
D A
S:
A
LL
C
OMP
ON
E
NT
SA
ND
MATE
RI
ALS
U
SE
DIN
TH
IS
ASSEM
BL
YARETO
B
E
R
oH
S
C
OMPLIA
NT
PE
R
E4253.
P.
C
.
BOARD
BLA
N
K
INFORM
ATI
ON
(MAKES8
B
OA
RD
SPE
R
PANEL,SEE ELE
CTR
ON
IC
FILE
F
OR
A
DDI
TI
ON
AL
IN
F
OR
MATI
ON)
BUYCO M
PLETEAS
L11396
-B
(
2LAYER BOARD PER E3281)
ITEM REQ'D
PART NO.
IDENTIFICATION
1 1 SEEBLANK I NFO.
P.C. BD. BLANK
21.0OZ.
E2861
SEALANT
32 S14020-7 PLASTICEXPANSI ON NUT
REFERENCES
QTY
PARTNO. DESCRIPTION
C1
1
S16668-5
.022/50
CR1,CR2 2
S14293-18
DPSTRELAY
D1,D3 2
T12199-1
1N4004
D2
1
T12705-58
DIODE,1.0A,1500V
N.C.
J60
1
S24020-8
HEADER,VERTICAL
N.C.
J61
1
S24020-10
HEADER,VERTICAL
OCI1
1
S15000-22
OPTOISOLATOR
R1,R2, R3, R6, R7, R8, R9, R10 8
S24376-3
100/1OW
R4
1
S19400-2673
267K1/4W
R5
1
S19400-4750
4751/4W
R11,R12, R13, R14, R15, R16,
R17,R18, R19, R20, R21, R22,
R23,R24, R25
15
S19400-3011
3.01K1/4W
TP1,TP2,TP3, TP4 4
T13640-23
MOV,250J,660V
XXXXXXX
XXXXXXXX
XXX
XXX
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
T
P1
T
P2
T
P3
OCI1
T
P4
C1
R4
R5
R2
R3
R10
R9
R6
R7
R8
R22
R24
R25
R23 R13
R14
R15
R16
R17
R18
R19
R20
R21
R12
R11
R1
D1
D2
D3
J61 J60
CR1
CR2
L1139
6-2
INPUT
0
6.00
±
.04
0
4.50
±
.04
1
N.
B.
N.D.
N.D. N.D.
N.D.
N.
A.
3
G-22
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