technology brief, 2nd edition
Abstract.............................................................................................................................................. 3
Overview of HP BladeSystem c3000 Enclosure....................................................................................... 3
Managing the c3000 enclosure ............................................................................................................5
Onboard Administrator.....................................................................................................................5
Detecting component insertion and removal..................................................................................... 5
Identifying components .................................................................................................................6
Managing power and cooling....................................................................................................... 6
Controlling components.................................................................................................................6
User interfaces for Onboard Administrator...................................................................................... 8
Security....................................................................................................................................... 8
Role-based user accounts...............................................................................................................8
Integrated Lights-Out 2 for c-Class server blades.................................................................................. 9
Insight Display................................................................................................................................. 9
Onboard Administrator cabling....................................................................................................... 10
Enclosure link cabling..................................................................................................................... 11
Enclosure-based DVD ROM.................................................................................................................12
Enclosure KVM Module...................................................................................................................... 12
Interconnect options and infrastructure..................................................................................................13
Interconnect modules...................................................................................................................... 15
Server blades................................................................................................................................16
Storage and other option blades...................................................................................................... 16
Mezzanine cards........................................................................................................................... 17
Virtual Connect.............................................................................................................................. 18
Fabric connectivity and port mapping...............................................................................................18
c3000 bay-to- bay crosslinks........................................................................................................... 21
Device bay crosslinks.................................................................................................................. 21
Interconnect bay crosslinks ..........................................................................................................22
HP Thermal Logic technologies............................................................................................................ 22
Active Cool fans ............................................................................................................................23
HP PARSEC architecture.................................................................................................................. 24
Parallel......................................................................................................................................24
Redundant and scalable.............................................................................................................. 25
Thermal Logic for the server blade....................................................................................................26
Power supplies and enclosure power subsystem................................................................................. 27
Pooled power configuration and power redundancy options........................................................... 29
Dynamic Power Saver mode........................................................................................................ 30
HP Power Regulator for ProLiant................................................................................................... 31
Power Capping for each server blade...........................................................................................31
Power meter ..............................................................................................................................31