AMD 8151 manuals

45 pages758.77 Kb

AMD-8151 Data Sheet
- Figure 1: System block diagram.
3Table of Contents
4List of Figures
5List of Tables
- Table 1: IO signal types.
- 6AMD-8151
- BL C
  - 824888 Rev 3.03 - July 12, 2004 AMD-8151TM AGP Tunnel Data Sheet
  - 3.3 AGP Signals
  - 9The SERR# and PERR# signals are not supported on the AGP bridge.
  - 13Table 2: Translation from AGP requests to link requests.
  - 14Figure 2: Configuration space.
  - 15Table 3: Configuration spaces.
  - Table 4: Memory mapped address spaces.
  - Table 5: Register attributes.
  - 34Table 6: Absolute maximum ratings.
  - Table 7: Operating ranges.
    - The following table shows DC characteristics for signals on the VDD33 power plane.
      - Typical Max Supply Parameter Description Current Power Current Power Comments
  - 35Table 8: Current and power consumption.
  - Table 9: DC characteristics for signals on the VDD33 power plane.
  - 36Table 10: DC characteristics for signals on the VDD15 power plane, AGP 2.0 signaling.
  - Table 11: DC characteristics for signals on the VDD15 power plane, AGP 3.0 signaling.
    - The following table shows AC specification data for common clock (A_PCLK) operation of AGP signals.
  - 37Table 12: AC data for clocks.
    - Symbol Parameter Description Min Max Units Notes
  - Table 13: AC data for common clock operation of AGP signals.
    - The following table shows AC specification data for clock-forwarded operation of AGP signals.
  - 38Table 14: AC data for clock-forwarded operation of AGP signals.
    - AGP 2X AGP 4X AGP 8X Symbol Parameter Description Min Max Min Max Min Max Units Notes
    - 7 Ball Designations
  - 39Figure 3: Ball designations.
    - Top side view.
      - 123456789101112131415161718192021222324 A
      - B
      - C
      - D
      - E
      - J
      - K
      - L
      - M
      - N
      - P
      - R
      - T
      - U
      - V
      - W
      - Y
      - AA
      - AB
      - AC
      - AD
      - 123456789101112131415161718192021222324
    - Alphabetical listing of signals and corresponding BGA designators.
  - 40Table 15: Signal BGA positions.
  - 41Table 16: Power and ground BGA positions.
    - 8 Package Specification
      - 4. Symbol "M" determines ball matrix size and "N" is number of balls.
      - per AMD 01-002.3.
      - b) Laser elements
      - 5. Dimension "b" is measured at maximum solder ball diameter
      - on a plane parallel to datum C.
  - 42Figure 4: Package mechanical drawing.
    - 6. "x" in front of package variation denotes non-qualified package c) Die and passive fudicials
    - 7. The following features are not shown on drawings:
    - a) Marking on die, label on package
    - GENERAL NOTES
  - Table 17: Test modes.
- 43
  - Figure 5: NAND tree.
- - 44NAND tree 2: output signal is STRAPL[4].