Compaq 164SX user manual Fan/Heat-Sink Assembly

Increasing Microprocessor Speed

Figure 5–1 Fan/Heat-Sink Assembly

Airflow

Screw, 6–32 × 0.625 in Qty 4

Torque to 3 ±1 in-lb

Fan

Clip, Heat-Sink/Chip/Fan

Nut, Hex,

Aluminum

Flats, Qty 2

Torque to15 ±2 in-lb

Heat Sink, with Fan Mounting Holes

Thermal Pad

Alpha 21164PC

a.Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used to improve the thermal conductivity between the chip package and the heat sink by replacing micro air pockets with a less insulative material. Perform the following steps to position the GRAFOIL pad:

1.Perform a visual inspection of the package slug to ensure that it is free of contamination.

2.Wearing clean gloves, pick up the GRAFOIL pad. Do not perform this with bare hands because skin oils can be transferred to the pad.

3.Place the GRAFOIL pad on the gold-plated slug surface and align it with the threaded studs.

Memory and Microprocessor Configuration 5–5