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HP Thermal Logic technologies
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BladeSystem Enclosure technologies
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Onboard Administrator
Command-line interface
HP BladeSystem Power Sizer
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Contents
HP BladeSystem c3000 Enclosure technologies
technology brief
Abstract
Overview of HP BladeSystem c3000 Enclosure
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HP Thermal Logic technologies
Active Cool fans
HP PARSEC architecture
Figure 4. HP BladeSystem c3000 self-sealing enclosure
Thermal Logic for the server blade and enclosure
Power supplies and enclosure power subsystem
HP BladeSystem Power Sizer
Pooled power
Connecting with no power redundancy configured
Interconnect options and infrastructure
Figure 9. Diagram of the HP BladeSystem c3000 signal midplane
Fabric connectivity and port mapping
Several port types are referenced in Figures 12 and
Mezzanine 1 and Interconnect Bay
Virtual Connect
Onboard Administrator
Enclosure-based DVD ROM
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Insight Display
Command-line interface
Onboard Administrator cabling
Web GUI
Enclosure link cabling
Recommendations
Summary
Appendix A. Acronyms in text
The following acronyms are used in the text of this document
Appendix B. Fan, power supply, and device bay population guidelines
Table B-1. Power supply placement
Number of power supplies
Power supply bays used
All power supply bays filled
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8 half-height server blades with both full-height dividers installed
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For more information
Call to action
For additional information, refer to the resources listed below
Send comments about this paper to TechCom@HP.com
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