Intel cc2300, cc3300 manual Installing ISC Server Instrumentation

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Intel Server Control Installation Guide

NOTE

If you uninstall ucd-snmp, you must also remove all related snmp and DMI packages. When you remove these packages, remove them in an order that eliminates dependency error messages. For example, if a dependency error message appears, remove the package mentioned in the error message.

Continue removing the dependent packages in this manner until the error messages stop.

4. Install the DMI service provider package located in the \Software\Linux\dmisnmp directory on the HP Server cc3300 & cc2300 User Information, Diagnostics & Utilities Resource CD by using the rpm command. For example, the following command installs a version of the DMI service provider package:

rpm –i dmisp-1.0-6.i386.rpm

5.Locate and install the ucd-snmp RPM, ucd-snmp-utils RPM, and dmi2snmp RPM packages. These packages are also located in the \Software\Linux\dmisnmp directory on the HP Server cc3300 & cc2300 User Information, Diagnostics & Utilities Resource CD . Use the rpm command to install each package. For example, the following three commands install versions of these three packages (Note that these names may not be the same for Linux 7.1):

rpm –i ucd-snmp-4.1.1-15smux.i386.rpm

rpm –i ucd-snmp-utils-4.1.1-15smux.i386.rpm rpm –i dmi2snmp-1.0-15.i386.rpm

6. Reboot the Linux server after you have installed all the packages.

Installing ISC Server Instrumentation

1.Insert the HP Server cc3300 & cc2300 User Information, Diagnostics & Utilities Resource CD into the Linux server CD ROM drive.

2.Mount the CD using either of the following methods.

Enter the mount command as follows: mount /mnt/cdrom

Use the Disk Management utility. To invoke this utility click the Start button, select System, and then select the Disk Management menu option.

2. List the contents of the HP Server cc3300 & cc2300 User Information, Diagnostics & Utilities Resource CD and make sure the ISC install packages and scripts are on the CD. You can locate these packages in the /Software/Linux directory. Use the following commands to move to that directory and list the files:

cd /mnt/cdrom/Software/Linux ls

You should see filenames similar to the following:

ipmidrvr-2.2.14.6.1.1smp-1.i386.rpm ipmidrvr-2.4.2.2smp-1.i386.rpm isc-3.5-1.i386.rpm

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Contents Document Release Date March Legal Information Contents Intel Server Control System Requirements OverviewWindows 2000 Requirements Windows 2000 Console Requirements Console Requirements OverviewRed Hat Linux 7.1 Requirements Additional Requirements for DMI-SNMP TranslationRequirements Service PartitionService Partition Installation InstallationBoot the Server from the Service Partition Locally Booting the Server from the Service Partition Remotely Booting the Server from the Service PartitionConfiguring the Server for EMP Access Option Entry Configuring the Server for LAN AccessIntel Server Control Installation Guide Using the Direct Platform Control DPC Console Using the Client System Setup Utility CssuEnabling LAN Events Linux Red Hat Installing Intel Server Control ISCCompatibility and Upgrade Issues Managed Server PreparationWindows 2000 Advanced Server ISC Installation Procedure for Windows 2000 Advanced ServerInstalling Linux DMI Service Provider You should see filenames similar to the following Installing ISC Server InstrumentationLaunching Intel Server Control ISC Configuring the SNMP-DMI MapperISC Console Intel Server Control H-P Network Node ManagerLANDesk Server Manager CA-Unicenter TNGDirect Platform Control Console Management Plug-In HP Carrier Grade Server Functionality MatrixRemote Boot/Access Service Partition Remote Repair

cc2300, cc3300 specifications

Intel has long been a key player in the semiconductor industry, renowned for its innovative microprocessors and technological advancements. Among its array of products are the CC3300 and CC2300, which are designed specifically for Internet of Things (IoT) applications. These chips are part of Intel's commitment to driving intelligence and connectivity at the edge of networks.

The Intel CC3300 is a highly integrated System-on-Chip (SoC) that combines advanced processing capabilities with state-of-the-art wireless connectivity. Targeting various applications, including smart homes, industrial automation, and wearable devices, the CC3300 offers excellent performance while maintaining energy efficiency. Its architecture supports low-power modes that extend battery life, making it suitable for devices that operate with limited energy resources.

Key features of the CC3300 include robust security protocols, enabling the implementation of secure connections crucial for IoT applications. The chip incorporates hardware-based security features such as encryption engines and secure boot mechanisms that protect data integrity and user privacy. Furthermore, the CC3300 supports multiple protocols, including MQTT and HTTP, allowing developers to choose the best communication method for their needs.

On the other hand, the Intel CC2300, while designed with similar considerations for IoT, emphasizes ultra-low-power consumption and compact design. It excels in scenarios where space is at a premium and where maintaining long battery life is critical. This SoC integrates various peripherals that streamline connectivity options, including Bluetooth, Zigbee, and other short-range communications. The CC2300 is particularly suitable for applications in smart wearables and sensor networks, where size and energy efficiency are paramount.

Both the CC3300 and CC2300 utilize advanced manufacturing technologies, ensuring high reliability and performance. These chips are built on cutting-edge processes that enhance their operational capabilities while reducing the carbon footprint. Additionally, Intel’s dedicated software and development tools facilitate faster prototyping and deployment, empowering developers to bring their innovative ideas to fruition.

In summary, the Intel CC3300 and CC2300 microcontrollers are pioneering solutions for modern IoT applications. With their rich feature sets, energy-efficient designs, and robust security measures, these SoCs are well-positioned to foster the next wave of intelligent, connected devices. By leveraging these technologies, developers can create versatile solutions that enhance the connectivity and functionality of everyday devices, contributing to the broader vision of a smart, interconnected world.