Bonding Driver Options, Bonding Driver Parameters

9–Linux Configuration for Bonding Mode and Virtual LAN (VLAN) Linux Bonding Mode

The output for this command is:

Ethernet Channel Bonding Driver: v3.0.1 (January 9, 2006)

Bonding Mode: load balancing (round-robin) MII Status: up MII

Polling Interval (ms): 100 Up Delay (ms): 50000 Down Delay (ms): 0

Slave Interface: eth16	<=========== up state
MII Status: up	<=========== up state
Link Failure Count: 0
Permanent HW addr: 00:0e:1e:00:11:d2
Slave Interface: eth15	<=========== up state
MII Status: up	<=========== up state
Link Failure Count: 0
Permanent HW addr: 00:0e:1e:00:11:d3
The dmesg command output is:

bonding: bond0: link status definitely up for interface eth16.

bonding: bond0: link status definitely up for interface eth15.

Bonding Driver Options

Options for the bonding driver are supplied as parameters to the bonding module at load time. They may be given as command line arguments to the modprobe command, but are usually specified in the /etc/modules.conf or /etc/modprobe.conf configuration file, or in a distribution-specific configuration file (some of which are detailed in the next section).

Bonding Driver Parameters

The available bonding driver parameters are listed in the following parameter is not specified, the default value is used. When initially bond, QLogic recommends that tail -f /var/log/messagesseparate window to watch for bonding driver error messages.

sections. If a configuring a be run in a

It is critical to specify the following parameters; otherwise, serious network degradation will occur during link failures.

miimon or arp_interval and

arp_ip_target

Most devices support miimon, so it is safe to use.

Options with textual values accept either the text name or, for backward compatibility, the option value. For example, mode=802.3ad and mode=4 set the same mode.

9-4	NE0154601-00 B

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