Delta Electronics E48SR manual Leaded Sn/Pb Process Recommend TEMP. Profile

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LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE

Temperature (°C )

250

200

150

100

50

Ramp-up temp. 0.5~3.0°C /sec.

2nd Ramp-up temp. Peak temp. Pre-heat temp. 1.0~3.0°C /sec. 210~230°C 5sec.

140~180°C 60~120 sec.

Cooling down rate <3°C /sec.

Over 200°C 40~50sec.

0

60		120	180		240		300
60		120	180		240		300
		Time ( sec. )

Note: The temperature refers to the pin of E48SR, measured on the pin +Vout joint.

LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE

.
Temp	Peak Temp. 240 ~ 245 ℃
	Peak Temp. 240 ~ 245 ℃
217℃		Ramp down
200℃		max. 4℃/sec.
200℃
150℃	Preheat time
	100~140 sec.	Time Limited 90 sec.
		Time Limited 90 sec.
	Ramp up	above 217℃
	Ramp up
25℃	max. 3℃/sec.
25℃		Time
		Time

Note: The temperature refers to the pin of E48SR, measured on the pin +Vout joint.

DS_E48SR15004_05222008

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Contents Options Parameter Technical SpecificationsTypical full load input characteristics at room temperature Electrical Characteristics CurvesFor Positive Remote On/Off Logic For Negative Remote On/Off LogicElectrical Characteristics Curves Output voltage noise and ripple measurement test setup Electrical Characteristics Curves Soldering and Cleaning Considerations Safety ConsiderationsDesign Considerations Input Source ImpedanceFeatures Descriptions Output Voltage Adjustment Trim Features Descriptions CONThermal Considerations Thermal Testing Setup Thermal DeratingThermal Curves Recommended PAD Layout SMD Pick and Place LocationLead Free SAC Process Recommend TEMP. Profile Leaded Sn/Pb Process Recommend TEMP. ProfileSurface-mount module Through-hole module Mechanical DrawingPin No Name Function Model List Part Numbering System