Shapes and Dimensions

(1/2)

Multilayer Chip Dual-Band Directional Couplers For GSM/DCS/PCS-Tx

Conformity to RoHS Directive

HHM Series HHM2317B3

0.25±0.2

		2.0±0.15						0.95±0.2
		3		2	1
		3		2	1

	4						8			±0.15
										±0.15
										1.25
												Terminal functions


													1	Band1 input port
		5		6	7								1	Band1 input port
0.65±0.1						0.3±0.2							2	GND
0.65±0.1						0.3±0.2					3			Band2 input port
													4	50Ω termination
													5	Band2 output port
													6	GND
												7		Band1 output port
												8		Monitor output port
												8		Monitor output port

									Dimensions in mm
0.2		±	0.2	0.35±	0.1				Dimensions in mm

CIRCUIT DIAGRAM

IN(2)	GND	IN(1)
3	2	1

	4	Monitor
		8 output
	50Ω

56 7

OUT(2) GND OUT(1)

RECOMMENDED PC BOARD PATTERNS

0.3

ø0.3 ø0.3

1.0

0.4

0.3	Dimensions in mm

This width is 50Ω.

CPW for 0.6mm thick Teflon substrate.

•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

•All specifications are subject to change without notice.

001-03 / 20080105 / e761_hhm2317b3

HHM Series HHM2317B3, GSM/DCS/PCS-Tx specifications

The TDK HHM Series HHM2317B3 is a cutting-edge RF front-end module designed specifically for GSM, DCS, and PCS transmission applications. This innovative component is engineered to meet the demanding requirements of modern wireless communication systems, ensuring efficient signal amplification and optimal performance in a compact footprint.

One of the standout features of the HHM2317B3 is its integration of advanced silicon-based technology, which enhances its efficiency and reliability. The module operates across a wide frequency range, supporting the GSM (Global System for Mobile Communications), DCS (Digital Cellular System), and PCS (Personal Communications Service) bands, making it versatile and adaptable for various telecommunications applications.

The HHM2317B3 integrates multiple functionalities into a single package, including a power amplifier, a low-noise amplifier, and necessary filtering components. This multi-functional approach simplifies the design process and reduces the overall size of the PCB layout, making it ideal for space-constrained environments such as smartphones and portable communication devices.

Another key characteristic of the HHM2317B3 is its high linearity and efficiency, which are critical for minimizing distortion and maximizing battery life. The module features advanced thermal management capabilities to ensure stable performance, even under challenging operating conditions. Furthermore, it offers high gain, which enhances signal quality and coverage, leading to improved user experience in mobile communication.

The HHM2317B3 module is designed with reliability and longevity in mind, undergoing stringent testing to meet industry standards. Its robust construction ensures it can withstand various environmental stressors, making it suitable for deployment in diverse applications.

In conclusion, the TDK HHM Series HHM2317B3 is a sophisticated and efficient RF front-end module that combines multiple functionalities into a compact design. With its wide frequency coverage, high linearity, and excellent efficiency, it is an essential component for modern GSM, DCS, and PCS communication systems. As the demand for high-performance mobile communications continues to grow, the HHM2317B3 stands out as a reliable solution that meets the evolving needs of the telecommunications industry.