Precautions, Soldering Information | Omron EE-SX1107 guide

Precautions

■Soldering Information

Reflow soldering

•The following soldering paste is recommended: Melting temperature: 216 to 220° C Composition: Sn 3.5 Ag 0.75 Cu

•The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm.

•Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered.

Temperature

1 to 5°C/s

1 to 5°C/s	150 to 180°C
1 to 5°C/s
	120 sec
	Time

260°C max.

255°C max.

230°C max.

10 sec max.

40 sec max.

Manual soldering

•Use “Sn 60” (60% tin and 40% lead) or solder with silver content.

• Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 350° C or below.

•Solder each point for a maximum of three seconds.

•After soldering, allow the product to return to room temperature before handling it.

Storage

To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions:

Temperature: 10 to 30° C

Humidity: 60% max.

The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time the product must be stored under 30° C at 80% maximum humidity.

If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope.

Baking

If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope was opened, bake the product under the following conditions before use:

Reel: 60° C for 24 hours or more

Bulk: 80° C for 4 hours or more

4Photomicrosensor (Transmissive) EE-SX1107