Z Microsystems Z MPU manual Component Overview, Scm

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Component Overview

2.0

TranzPak 7

2.1

SCM

Hot swap TranzPak 7 Modules contain environmentally sealed IDE or SCSI hard drives.

Hot swap SCM’s contain environmentally sealed COTS motherboards. Keep your configurations current with the latest Intel/Sun motherboards.

2.2Inside Look

Dedicated 28 VDC

Power and ATX

Interface Board

Heatsinks conduct thermal energy to module cover for dispersion

Internal DC Power Input and Switched USB

External I/O Connectors

Transition

Board

PCI Card

Dedicated Disk (SCSI or IDE)

ATX Motherboard (Intel or Sun)

Operator Front

Each docking slot has a transition board that mates with the removable SCM and its dedicated TranzPak 7 disk module. Inside each SCM an interface board generates the required voltages and transitions the motherboard’s I/O signals to the outside world.

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Contents Zmpu Independent Stand Alone Systems System OverviewSCM Component OverviewMaximum Flexibility Shared Peripherals & System AdministrationWeb Based SysAdmin Shared Peripheral ClustersMicrosystems Multi Processor Unit System Architecture Future Proof Technology InsertionMPU