Dukane AS2 specifications Audio Visual Products

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Audio Visual Products

2900 Dukane Drive

Toll Free: 800-676-2487

St.Charles, IL 60174

Fax: 630-584-5156

www.dukcorp.com/av

e-mail: avsales@dukcorp.com

070016 User’s Guide

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Contents AirSlate Dukane AirSlate AS2 Battery Installation for Slate & Pen LED Indicator Information for the SlateOperation in Wireless Bluetooth mode Software Installation For Windows XP, Service Pack 2 Only Wireless mode using the Bluetooth linkStep Dukane Audio Visual Products 800-676-2485 AirSlate AS2 Then Next Dukane Audio Visual Products 800-676-2485 AirSlate AS2 Wired Mode using the USB cable Operation of SlateOffice Ink Overview Power Presenter RE2 Free Notes OverviewPower Presenter RE2 Easiteach Easiteach Using Multiple Slates Page Page Using Multiple Slates Adjusting the Slate IconPage Changing Pens Pen Offset Value Troubleshooting TroubleshootingMy computer does not detect the USB Bluetooth Adapter LED on my Bluetooth Tablet does not light upHave lost my nib the tip of my pen Your pen is supplied with two spare nibs. See Appendix BPage Dukane Audio Visual Products 800-676-2485 AirSlate AS2 Bluetooth Adapter Hardware Installations Initial Setup only for the very first time installation To continue, click Next Give your computer a Device NamePage Stat to Pair Bluetooth Pen Pad Page What is Pairing? Double click on My Bluetooth PlacesBluetooth Product Specification How to UnpairBluetooth Tablet Maintenance Bluetooth PenAppendix a How to Identify Windows XP Service Pack Appendix B Pen Tip Replacement Page Page Audio Visual Products

AS2 specifications

Dukane AS2 is an advanced ultrasonic bonding machine engineered for efficiency and precision in the assembly of various components across multiple industries. Known for its innovative technology and robust design, the Dukane AS2 is a preferred choice for manufacturers looking to enhance production methods while maintaining high-quality standards.

One of the main features of the Dukane AS2 is its ability to deliver consistent ultrasonic energy during the bonding process. This ensures that materials, regardless of their type or thickness, are bonded with the utmost integrity. The machine is equipped with advanced digital controls that allow for easy adjustment of settings, thereby optimizing the bonding parameters for specific applications. This versatility makes it suitable for a wide range of materials including plastics, fabrics, and composites.

The Dukane AS2 also incorporates state-of-the-art ultrasonic technology, which enables rapid bonding without the need for additional adhesives or solvents. This not only reduces production costs but also minimizes environmental impact. The ultrasonic waves generate localized heat that fuses materials quickly, resulting in strong and durable joints. This feature is particularly beneficial for the automotive, medical, and packaging industries, where reliability and precision are paramount.

In addition to its ultrasonic capabilities, the Dukane AS2 is designed with user-friendliness in mind. The intuitive interface allows operators to easily program and monitor the bonding process. Its compact design enables integration into existing production lines without requiring extensive modifications, facilitating a smooth transition to advanced ultrasonic bonding.

Another notable characteristic is the machine’s ability to perform applications in a cleanroom environment, making it ideal for industries that demand stringent cleanliness standards, such as pharmaceuticals and electronics. The robust build quality ensures durability and longevity, even in high-demand manufacturing settings.

Overall, the Dukane AS2 stands out as a modern solution for ultrasonic bonding, combining cutting-edge technology, user-friendly design, and flexible applications. Its focus on efficiency, reliability, and environmental conservation makes it a valuable asset for manufacturers looking to elevate their production capabilities while adhering to stringent quality norms. As industries continue to evolve, the Dukane AS2 remains a key player in meeting the challenges of modern bonding techniques.