Compaq 505B manual RoHS Compliance, Material Usage, Packaging, End-of-life, Management Recycling

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QuickSpecs

Compaq 505B Microtower PC

Technical Specifications - Environmental Data

RoHS Compliance

Hewlett-Packard is committed to compliance with all applicable environmental laws and

 

regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive.

 

HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive

 

on a worldwide basis. By July 1, 2006, RoHS substances will be virtually eliminated (virtually = to

 

levels below legal limits) for all HP electronic products subject to the RoHS Directive, except

 

where it is widely recognized that there is no technically feasible alternative (as indicated by an

 

exemption under the EU RoHS Directive).

Material Usage

This product does not contain any of the following substances in excess of regulatory limits (refer

 

to the HP General Specification for the

 

Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/

 

supplychain/gen_specifications.html):

 

Asbestos

 

Certain Azo Colorants

 

Certain Brominated Flame Retardants – may not be used as flame retardants in plastics

 

Cadmium

 

Chlorinated Hydrocarbons

 

Chlorinated Paraffins

 

Formaldehyde

 

Halogenated Diphenyl Methanes

 

Lead carbonates and sulfates

 

Lead and Lead compounds

 

Mercuric Oxide Batteries

 

Nickel – finishes must not be used on the external surface designed to be frequently

 

handled or carried by the user.

 

Ozone Depleting Substances

 

Polybrominated Biphenyls (PBBs)

 

Polybrominated Biphenyl Ethers (PBBEs)

 

Polybrominated Biphenyl Oxides (PBBOs)

 

Polychlorinated Biphenyl (PCB)

 

Polychlorinated Terphenyls (PCT)

 

Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has

 

been voluntarily removed from most applications.

 

Radioactive Substances

 

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging

HP follows these guidelines to decrease the environmental impact of product packaging:

 

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in

 

packaging materials.

 

Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

 

Design packaging materials for ease of disassembly.

 

Maximize the use of post-consumer recycled content materials in packaging materials.

 

Use readily recyclable packaging materials such as paper and corrugated materials.

 

Reduce size and weight of packages to improve transportation fuel efficiency.

 

Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic

Management and

areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest

Recycling

HP sales office. Products returned to HP will be recycled, recovered or disposed of in a

 

responsible manner.

 

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for

 

each product type for use by treatment facilities. This information (product disassembly

 

instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These

 

instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM

 

customers who integrate and re-sell HP equipment.

Hewlett-Packard

For more information about HP's commitment to the environment:

Corporate

Global Citizenship Report

DA - 13427 Worldwide QuickSpecs — Version 2 — 10.30.2009

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Contents Microtower OverviewAt a Glance Supported Operating Systems and PreinstalledProcessor and Speed Application SoftwareOptical Drives Serial ATA Hard DrivesSystem Memory StorageMiscellaneous GraphicsPCI System DetailsChassis Front Panel Cooling SolutionsPower Supply Temperature Range OperatingPWM BiosLOM Power Conservation RTL8201EL 10/100 Fast FeaturesDesktop NIC Features WirelessVibration ShockAfter-Market Options availability may vary by country Standard Memory Optional Memory UpgradesMemory DDR Synch Dram NON-ECC MemoryMaximum Quantity Supported Position Supported Controller StorageTechnical Specifications Audio Technical Specifications Communications Output power approximately 802.11b/g/n PCIe WeightStorage temperature Power consumptionCertifications AntennaEMC Ramdac Technical Specifications GraphicsDVI Portuguese, Russian, Spanish, Swedish, Thai, Turkish ESD Technical Specifications Input DevicesEMI RFI Key-leveling HP USB Mini-Keyboard Physical KeysMechanisms Cable length EMI-RFI MtbfTechnical Specifications Hard Drives QuickSpecs Technical Specifications Optical Storage DVD-R CD-ROM, CD-R DVD-ROM, DVD+RTechnical Specifications Miscellaneous Technical Specifications Environmental Data End-of-life RoHS ComplianceMaterial Usage PackagingEnvironmental Information