Description
PROCESS-DV18MST(TSB) “C-AL,SMD” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-AL,SMD” “C-AL,SMD” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-AL,SMD” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-AL,SMD” “C-TA,CHIP” “C-AL,SMD” “C-CERAMIC,CHIP” “C-AL,SMD” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-AL,SMD” “C-AL,SMD” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-AL,SMD” “C-CERAMIC,CHIP” “C-AL,SMD” “C-CERAMIC,CHIP” “C-AL,SMD” “C-CERAMIC,CHIP” “C-CERAMIC,CHIP” “C-AL,SMD” “C-CERAMIC,CHIP” “C-AL,SMD” “C-CERAMIC,CHIP” “C-AL,SMD”
Specification
“DV18MST,DAVINCH(TSB),-,-” “10uF,20%,16V,GP,TP,4.3x4.3x5.4” “10nF,10%,50V,X7R,TP,1608” “10nF,10%,50V,X7R,TP,1608” “100uF,20%,25V,-,TP,8.3x8.3x6.3” “100uF,20%,16V,GP,TP,6.6x6.6x5.” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100uF,20%,16V,GP,TP,6.6x6.6x5.” “10nF,10%,50V,X7R,TP,1608” “10nF,10%,50V,X7R,TP,1608” “10nF,10%,50V,X7R,TP,1608” “10nF,10%,50V,X7R,TP,1608” “100uF,20%,25V,-,TP,8.3x8.3x6.3” “100UF,20%,16V,GP,TP,7343” “100uF,20%,16V,GP,TP,6.6x6.6x5.” “100nF,10%,16V,X7R,TP,1608” “100uF,20%,16V,GP,TP,6.6x6.6x5.” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “10uF,20%,16V,GP,TP,4.3x4.3x5.4” “100uF,20%,25V,-,TP,8.3x8.3x6.3” “10nF,10%,50V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “100nF,10%,16V,X7R,TP,1608” “10nF,10%,50V,X7R,TP,1608” “10uF,20%,16V,GP,TP,4.3x4.3x5.4” “10nF,10%,50V,X7R,TP,1608” “10uF,20%,16V,GP,TP,4.3x4.3x5.4” “0.47nF,5%,50V,NP0,TP,1608” “10uF,20%,16V,GP,TP,4.3x4.3x5.4” “10nF,10%,50V,X7R,TP,1608” “10nF,10%,50V,X7R,TP,1608” “10uF,20%,16V,GP,TP,4.3x4.3x5.4” “100nF,10%,16V,X7R,TP,1608” “10uF,20%,16V,GP,TP,4.3x4.3x5.4” “10nF,10%,50V,X7R,TP,1608” “10uF,20%,16V,GP,TP,4.3x4.3x5.4”