LG Electronics 47LM760S/760T-ZB IC Remove/Replacement, Removal, Circuit Board Foil Repair

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IC Remove/Replacement

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the cir- cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1.Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2.Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1.Carefully insert the replacement IC in the circuit board.

2.Carefully bend each IC lead against the circuit foil pad and solder it.

3.Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1.Remove the defective transistor by clipping its leads as close as possible to the component body.

2.Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3.Bend into a "U" shape the replacement transistor leads.

4.Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1.Heat and remove all solder from around the transistor leads.

2.Remove the heat sink mounting screw (if so equipped).

3.Carefully remove the transistor from the heat sink of the circuit board.

4.Insert new transistor in the circuit board.

5.Solder each transistor lead, and clip off excess lead.

6.Replace heat sink.

Diode Removal/Replacement

1.Remove defective diode by clipping its leads as close as pos- sible to diode body.

2.Bend the two remaining leads perpendicular y to the circuit board.

3.Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4.Securely crimp each connection and solder it.

5.Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1.Clip each fuse or resistor lead at top of the circuit board hollow stake.

2.Securely crimp the leads of replacement component around notch at stake top.

3.Solder the connections.

CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec- tions).

1.Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2.carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3.Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4.Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1.Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2.Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con- nected to the affected copper pattern.

3.Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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Contents SERVICE MANUAL MODEL 47LM760S/760T 47LM760S/760T-ZBLED LCD TV 47LM761S/761T 47LM761S/761T-ZA 47LM765S/765T 47LM765S/765T-ZDOnly for training and service purposes CONTENTSCopyright LG Electronics. Inc. All rights reservedIMPORTANT SAFETY NOTICE SAFETY PRECAUTIONSBefore returning the receiver to the customer Leakage Current Cold CheckAntenna Cold CheckElectrostatically Sensitive ES Devices SERVICING PRECAUTIONSReplacement IC Remove/ReplacementSmall-Signal Discrete Transistor Removal/Replacement Removal4. Model General Specification SPECIFICATION1. Application range 2. Requirement for Test4.0Msymbols/s to 7.2Msymbols/s Symbolratesymbolrate DVB-S2 8PSK / QPSK 2 ~ 45Msymbol/s6. RGB input PC 5. Component Video Input Y, Cb/Pb, Cr/Pr7.2. PC mode 7. HDMI Input 7.1. DTV mode3. Automatic Adjustment ADJUSTMENT INSTRUCTION1. Application Range 2. Designation3.4. LAN PORT INSPECTIONPING TEST 3.2. MAC address D/L, CI+ key D/L, Widevine key D/L, ESN D/LSET PC 3.3. LAN3.5. Model name & Serial number Download 3.7. WIFI MAC ADDRESS CHECK3.6. CI+ Key checking method 3.5.1. Model name & Serial number D/L4.1.1. Overview 4. Manual Adjustment4.1.2. Equipment 4.1.3. Download method4.2.4. Adj. Command Protocol 4.2. White Balance Adjustment4.2.1. Overview 4.2.2. Equipment4.3. EYE-Q function check 4.5. Magic Motion Remote control test4.4. Local Dimming Function Check 4.2.7. LED White balance table4.6. 3D function test 4.7. Wi-Fi Test4.8. LNB voltage and 22KHz tone check 4.9. Option selection per country4.12. GND and Internal Pressure check 6. USB S/W DownloadService only5. Audio Side BLOCK DIAGRAMRear HDMIEXPLODED VIEW NVRAM EAX6430790* LD22* / LC22 EAX6443420* LT22* / LJ22* / LA22* / LB22X-TAL JTAG 10KPLACE AT JACK SIDE PLACE AT JACK SIDEPlace at JACK SIDE 12.5TGASKITSMDUSB3 SMD Gaskit12.5TGASKITSMDUSB1 PLACE AT IC6000 PLACE AT JACK SIDEPLACE AT MAIN SOC SIDE IC703 IC701 H5TQ2G63BFR-PBCH5TQ2G63BFR-PBC IC105 LGE2112LGE Internal Use Only PowerDET FROM LIPS & POWER B/DPANELPOWER On-semiFor Debug Renesas MICOMMICOM MODEL OPTION Eye Sensor OptionUI HDMI3 HDMI1HDMI4 UI HDMI2SPDIF OUT RGB/ PC AUDIO/ SPDIFPC AUDIO JK3603 SLIM-15F-D-2JACKCOMMON ESD for MTKCOMPONENT 1 PHONE JACK RS232CCVBS 1 PHONE JACK Zener Diode is IR & KEYclose to wafer RGB Sensor+5VUSB FOR USB1 USBWIFIUSB1 USB2 MAX 1.5A2011.10.26 Full Scart18 Pin GenderSCART GENDER ALL MREMOTE OPTION ZigBeeRadio Pulse MREMOTE OPTIONAR4800 1/16WEthernet Block STA380BW IC5800GP4MT5369 2011.11.21AUDOUT EU/CHINAHOTELOPT SCART AUDIO MUTEIC6000 A Z4580MTR-E1HEADPHONE AMP EARPHONE AMPOption FOR LG1152 Option FOR MTKVout=0.6*1+R1/R2 T/C/S & H/NIM & T2/C TUNEREU & CHINATU6500 TU6501DVB-S2 LNB Part Allegro OptionLNBDCDCGND and AGND are connected DCDCGND and AGND are connected in pin#27FOR COMMERCIAL 12V OUT RS-232C 9 PIN OPTCOMMEREXT12V AUDIO OUT JACK OPTCOMMEREXTAMP COMMEREXTAMPJACKFOR COMMERCIAL AUDIO OUT OPTCOMMEREXTAMP COMMERCIALOPTION51Pin LVDS OUTPUT Connector 41Pin LVDS OUTPUT Connector LVDSLVDSHIGHMID 2011.08.11L/DIMOUT LOCAL DIMMINGAR7600 THIS IS REVERSE PATTERN POWER BLOCKLEVEL SHIFTER BLOCK T-ConeMMC I/F Don’t Connect Power At VDDIHYNIXEMMC2GB Just Interal LDO CapacitorLOGOLIGHT R8901 10K Place Near MicomPage 2012 LED/LCD TV Engineering guide Applicable Model XXLM760S-ZBNew features Main PCBs Block Diagrams, IIC Map CONTENTInstruction of new sub ass’ys How to use tool Download Adjust way of new features widevine… Repair guideMerits EPIEmbedded Point-Point Interface FeaturesEPI Interface HF mini-LVDS TCON EPI Interface mini-LVDS vs. EPIComparison What to changeHF mini-LVDS WIFI Main PCB for BroadbandxxLM760S-ZB Chassis LD22E PCB P/No EAX64307905Power load MTK5369 Block Diagram LM76Side RearMain SoC MTK Jack InterfaceFull Scart18 Pin Gender IC6100R0 옴 GP4 Backend block diagram EPI & T-conR 47옴 EPI CH1/2/3 GP4 Backend block diagram EPI & T-ConEPI CH4/5/6 50PinLVDS Tx Block GP4 Backend block diagram LVDS Tx & Local DimmingDual-link LVDS Output LVDSSEL “H”=JEIDA, “L” or NC=VESA LGDPCBs InterconnectionCables xxLM760S-ZAAss’y Picture Pin Configuration Circuit Block Diagram2012Y IR + Soft touch PCB Pinmap KEY1, KEY2 VoltageSpec 내용 Power LED Scenario2012Y IR + Soft Touch LED Lighting Scenario Touch Key Threshold Level Ta = 25ºC Introductions of GP4 Sensor Touch ICManual of Touch Sensitivity Addr Value Touch EEPROM Register change with USB portIntroductions of 12Y RF ass’y + Magic Remote control ™ Pairing Information Transmission Send to TV after Paired 1. SystemPairing Information Transmission Sequence ™ Motion Data Transmissionmute powerhome ← ok →AA x 2 Battery 3. M4 Block DiagramPower Management Connector주요 Item 4. Function listManufacturer FunctionDescription 5. RF Pairing / Un-pairing MethodMethod Introductions of 12Y WIFI built in ass’y Block diagram WIFI Built in ass’y featureLGITPin map WIFI built in featureWIFI Built in Block-diagramArcadyan WIFI Built in ass’y Specification 1. Widevine? 2. HDCP 2.0 & NETFLIX? 3. DTCP? 4. Changed BOM 12Y Widevine & HDCP 2.0 & NETFLX1. Widevine? ‰ Netflix 2. HDCP 2.0 & NETFLIX?‰ Why HDCP2.0? ‰ HDCP3. DTCP? As-Was 4. Changed BOMCurrent Æ 추가4. Changed BOM Contents of LCD TV Standard Repair Process Error symptom Contents of LCD TV Standard Repair Process Detail Technical ManualContent PageA2 Check Power Board 24v output Main B/D↔ Power B/D, LVDS Cable,Speaker Cable,IR B/D CableCheck Power Board 12v,3.5v etc Replace T-con Board or module And Adjust VCOMRevised date Check various voltages of Power Board3.5V,12V,20V or 24V… Normal Y voltage?S/W Version Check RF Signal levelCheck Check S/W Version A10/ A11 Color error?Check color by input -External Input COMPONENT -RGB ※ Check andVertical/Horizontal bar, residual image, light spot External device screen error-Color errorReplace Main B/D adjust VCOM External Input error Component error RGB error HDMI DVIPower LED Y On? Check Power LEDCheck Power On ‘”High” Measure voltage of each output of Power B/DCheck Power Off Mode Error?If Power Off mode is not displayed Check Power B/D voltage Power off ListCheck user menu Speaker off of Power BoardCheck audio B+ NormalCheck audio B+ Voltage In case of External Input signal error Check and fix external deviceCheck IR Output signal Check & Repair Cable connection Connector solderCheck 3.5v on Power B/D Replace Power B/D or Replace Main B/D Power B/D don’t have problemaccordance Recognition errorExternal Input and Identify nose type F. Exterior defect Adjust VCOMError symptom ALL MODELS Standard Repair Process Detail Technical ManualSMAW200-H24S YEONHO 24 Pin Power Board ↔ Main BoardEdge LED Standard Repair Process Detail Technical Manual 1. Checking method for remote controller for adjustment Standard Repair Process Detail Technical Manual Checking method Standard Repair Process Detail Technical Manual Appendix Exchange T-Con Board Abnormal Display Fuse Open, Abnormal power sectionGRADATION NoiseNo Light Appendix Exchange PSULED driverDim Light No picture/Sound OkUn-repairable Cases In this case please exchange the module Appendix Exchange the ModuleUn-repairable Cases In this case please exchange the module Appendix Exchange the ModuleStandard Repair Process Detail Technical Manual Edge LED Edge LED When st-by, only 3.5V is normally onFor ’10 models, there is no voltage out for st-by purpose Check “power on” pin is high B. Power error Off when on, off whiling viewing Standard Repair Process Detail Technical Manual Only for training and service purposesALL MODELS dateALL MODELS Standard Repair Process Detail Technical ManualALL MODELS LCD module change T-Con board change