B2-2 | Toshiba 14N21NS instruction

DISASSEMBLY INSTRUCTIONS

INSTALLATION

1.Take care of the polarity of new IC and then install the new IC fitting on the printed circuit pattern. Then solder each lead on the diagonal positions of IC temporarily.

(Refer to Fig. 2-5.)

Soldering Iron

Solder temporarily

Fig. 2-5

2.Supply the solder from the upper position of IC leads sliding to the lower position of the IC leads.

(Refer to Fig. 2-6.)

Solder	Soldering Iron
IC	Supply soldering
	Supply soldering
	from upper position
	to lower position

Fig. 2-6

3.Absorb the solder left on the lead using the Braided Shield Wire. (Refer to Fig. 2-7.)

NOTE

Do not absorb the solder to excess.

Soldering Iron

4.When bridge-soldering between terminals and/or the soldering amount are not enough, resolder using a Thin- tip Soldering Iron. (Refer to Fig. 2-8.)

Thin-tip Soldering Iron	IC

Fig. 2-8

5.Finally, confirm the soldering status on four sides of the IC using a magnifying glass.

Confirm that no abnormality is found on the soldering position and installation position of the parts around the IC. If some abnormality is found, correct by resoldering.

NOTE

When the IC leads are bent during soldering and/or repairing, do not repair the bending of leads. If the bending of leads are repaired, the pattern may be damaged. So, be always sure to replace the IC in this case.

Braided Shield Wire

Fig. 2-7