Sony MX-E500 specifications Table of Contents, Disassembly, Diagrams, Exploded Views

TABLE OF CONTENTS

1.SERVICING NOTE ···················································· 3

2.GENERAL ·································································· 4

3.DISASSEMBLY

3-1. “Panel Block Assy, Upper”,

“Holder Assy” ································································· 5 3-2. Mechanism Deck ···························································· 5

3-3. Bracket Assy ··································································· 6

3-4. Main Board ····································································· 6

3-5. Optical Pick-up Block ···················································· 7

4.TEST MODE ······························································ 8

5.ELECTRICAL ADJUSTMENTS ··························· 12

6.DIAGRAMS

6-1. Block Diagram ······························································ 17

6-2. Printed Wiring Boards – Main Section (1/2) – ············· 19

6-3. Printed Wiring Boards – Main Section (2/2) – ············· 21

6-4. Schematic Diagram – Main Section (1/3) – ·················· 23

6-5. Schematic Diagram – Main Section (2/3) – ·················· 25

6-6. Schematic Diagram – Main Section (3/3) – ·················· 27

6-7. IC Block Diagrams ······················································· 29

6-8. IC Pin Function Description ········································· 31

7.EXPLODED VIEWS

7-1. Main Section ································································· 37

7-2. Mechanism Deck Section (MT-MZE500-174) ············· 38

8.ELECTRICAL PARTS LIST ·································· 39

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270°C during repairing.

•Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering or unsoldering.

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam- aged by heat.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINE WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS

LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

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