HP t5730 t5730 manual End-of-life Management, Recycling, Hewlett-Packard, Information

Page 11

QuickSpecs

HP Compaq t5730 Thin Client

Technical Specifications

 

product packaging:

 

Eliminate the use of heavy metals such as lead, chromium,

 

mercury and cadmium in packaging materials.

 

Eliminate the use of ozone-depleting substances (ODS) in

 

packaging materials.

 

Design packaging materials for ease of disassembly.

 

Maximize the use of post-consumer recycled content materials in

 

packaging materials.

 

Use readily recyclable packaging materials such as paper and

 

corrugated materials.

 

Reduce size and weight of packages to improve transportation

 

fuel efficiency.

 

Plastic packaging materials are marked according to ISO

 

11469 and DIN 6120 standards.

End-of-life Management

Hewlett-Packard offers end-of-life HP product return and recycling

and Recycling

programs in many geographic areas. To recycle your product, please

 

go to:

 

http://www.hp.com/recycle or contact your nearest HP sales office.

 

Products returned to HP will be recycled, recovered or disposed of in a

 

responsible manner.

 

The EU WEEE directive (2002/95/EC) requires manufacturers to

 

provide treatment information for each product type for use by treatment

 

facilities. This information (product disassembly instructions) is posted on

 

the Hewlett Packard web site at: http://www.hp.com/go/recyclers.

 

These instructions may be used by recyclers and other WEEE treatment

 

facilities as well as HP OEM customers who integrate and re-sell HP

 

equipment.

Hewlett-Packard

For more information about HP's commitment to the environment:

Corporate Environmental

[link to new HP white paper now in progress]

Information

Global Citizenship Report:

 

http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

 

Eco-label certifications:

 

http://www.hp.com/hpinfo/globalcitizenship/environment/

 

productdesign/ecolabels.html

 

ISO 14001 certificates:

 

http://www.hp.com/hpinfo/globalcitizenship/environment/

 

operations/envmanagement.html

© 2007 Hewlett-Packard Development Company, L.P.

Microsoft, Windows, and Windows NT are trademarks or registered trademarks of Microsoft Corporation in the United States and other countries. AMD and Geode are trademarks of Advanced Micro Devices, Inc.

The information contained herein is subject to change without notice and is provided "as is" without warranty of any kind.

DA – 12888 North America — Version 1 — January 25, 2008

Page 11

Image 11
Contents Front Back QuickSpecsWith optional t5730/t5735 Expansion Module Kit Top At a GlanceFlash Memory Integrated WirelessProcessor Operating SystemUSB or PS/2 Input Devices AccessoriesPart Number CommunicationsPeripheral Support Mode Color depth Refresh rateMemory Flash Memory System Memory Input/Output KeyboardProtocols and Session Brokers ConnectorsLanguages MUI Dimensions H x W x D approximate Terminal ServerWarranty When using the QuickPower1 SafetyPackaging Environment-friendly RoHS ComplianceMaterial Usage Information End-of-life ManagementRecycling Hewlett-PackardQuickSpecs