HP 110c-1150EB, 110c-1130EK, 110c-1100DX, 110c-1147NR manual Heat sink assembly, Fan see Fan on

Heat sink assembly

Description	Spare part number
Heat sink assembly (includes replacement thermal material)	537619-001

Before removing the heat sink assembly, follow these steps:

1.Shut down the device. If you are unsure whether the device is off or in Hibernation, turn the device on, and then shut it down through the operating system.

2.Disconnect all external devices connected to the device.

3.Disconnect the power from the device by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the device.

4.Remove the battery (see Battery on page 44).

5.If your device has WWAN capability, remove the SIM (see SIM on page 45).

6.Remove the following components:

a.Keyboard (see Keyboard on page 48)

b.Hard drive or solid-state drive (see Mass storage devices on page 54)

c.Top cover (see Top cover on page 57)

d.WLAN module (see WLAN module on page 60)

e.Fan (see Fan on page 68)

Remove the heat sink assembly:

1.Remove the 4 Phillips SP1.5×1.05 screws (1) that secure the heat sink assembly to the system board.

NOTE: The screws are numbered 1 through 4. Follow this order when removing the screws.

70 Chapter 4 Removal and replacement procedures