HP 9470M C7Q19AW#ABA HP Fingerprint Sensor, Configurable Operating Temperature, ESD Resistance

Page 16

QuickSpecs

HP EliteBook Folio 9470m

Technical Specifications

HP Fingerprint Sensor

Mobile Voltage Operation

3.0V-3.6V Single Supply

(configurable)

Operating Temperature

32° - 158°F (0° - 70°C)

 

 

Current Consumption @

Less than 70 mA peak imaging and scrolling

 

3.3V

Less than 25 mA hardware finger detection

 

 

Advanced Power Management

 

High-Rate Image Capture

Up to 240 image frames /sec

 

ESD Resistance

IEC 61000-4-2 Level 4 (±15KV)

 

Detection Matrix

192 x 16 Pixels

 

 

9.7 mm x 0.81 mm

 

 

500 ppi High-Resolution Images

 

 

 

NETWORKING/COMMUNICATIONS

Intel® 82579LM Gigabit

Ethernet Features

10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)

Network Connection

 

100 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)

 

 

100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)

 

 

1000 Mbti/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023. Clauses 40)

 

 

Auto-Negotiation (Automatic Speed Selection)

 

 

Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100

 

 

Mbit/s

 

 

IEEE 802.1p QoS (Quality of Service) Support

 

 

IEEE 802.1q VLAN support

 

 

IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)

 

 

IEEE 802.3az EEE(Energy Efficient Ethernet)

 

 

Jumbo Frame 9K

 

 

Auto MDI/MDIX Crossover cable detection

 

Power

ACPI compliant - multiple power modes

 

Management

Energy Detect Low Power Mode(Green Ethernet)

 

Performance

TCP/IP/UDP Checksum Offload (configurable)

 

Features

Protocol Offload( ARP & NS)

 

 

Large send offload and Giant send offload

 

 

Receiving Side Scaling

 

 

MACSec Offload (802.3ae)

 

 

Intel vPro

 

 

iSCSI Boot

 

Manageability

Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft

 

 

Wake-Up Frame); Wake-on-LAN from off (Magic Packet only)

 

 

PXE 2.1 Remote Boot

 

 

Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x,

 

 

clause 30))

 

 

Comprehensive diagnostic and configuration software suite

 

 

Virtual Cable Doctor for Ethernet cable status

 

Interface

PCI Express 1.1 x1 to fully support ASPM L0s/L1 and CLKREQ.

 

 

NOTE: Intel 82579 PCIe interface is not PCIe compliant. It operates at half of

 

 

PCIe specification V1.1 (2.5GT/S) speed.

DA - 14317 North America — Version 10 — August 15, 2013

Page 16

Image 16
Contents QuickSpecs At a Glance Processor Operating SystemChipset Graphics DisplayInternal ExternalStorage and Drives Flash Cache ModuleMemory NETWORKING/COMMUNICATIONS AUDIO/MULTIMEDIAKEYBOARDS/POINTING DEVICES/BUTTONS & Function Keys Software and SecurityOptional Power Weights & Dimensions Service and SupportEnvironmental PORTS/SLOTSSystem Unit Pixel Resolution Pitch ConfigurationAnti-glare Diagonal Size Surface Treatment500 GB 7200 rpm Sata Hard Drive Drive Weight FeaturesFeatures ATA Security Internal Storage320 GB 7200 rpm Sata Hard Drive Drive Weight Features ATA Security ATA-8 Sata 3.0 Dipm TrimFeatures ATA Security ATA-8, Sata 3.0 Dipm Trim 32 to 158F 0 to 70C case tempFeatures ATA Security ATA-8 compliant Sata 3.0 Dipm Trim Drive Weight GramsSecurity Configurable Operating Temperature Intel 82579LM Gigabit Ethernet FeaturesPower HP Fingerprint SensorWireless Protocol Wireless ParametricMaximum Power Consumption Power Consumption Sleep Mode Power ManagementConfiguration Utilities Not Connected Power ManagementLED Activity HP un2430 Technology/OperatingConsumption Power Consumption Sleep Mode Power ManagementHP lt2522 LTE/EV-DO Technology/Operating Mobile Broadband Module BandsStandards Wireless Parametric HP lt2523 LTE/HSPA+ Technology/OperatingMedia Access Protocol 6205Interoperability Frequency BandDimensions Bluetooth v4.0 comboAntenna Connections Operating VoltageOutput Power Configuration UtilityTransmit Power Bluetooth SoftwareBluetooth Profiles Number of Available47 5.725 GHz 5.825 5.850 GHz Mounted in the display enclosure Bluetooth Specification DBPSK, DQPSK, CCK, OFDM, BPSK, QPSK, 16-QAM, 64-QAM Bluetooth 4.0 Wireless Bluetooth Specification TechnologyTechnology Dimensions 16, 20 or 24-bit Power Rating Watts Impedance OhmsOr 20-bit First three years of operation Shutdown14 to 122 F-10 to 50 C Energy Consumption Environmental DataHeat Dissipation ISO 7779 and ISO BatteriesAdditional InformationMaterial Usage QuickSpecs Type Description Cases DockingInput/Output Mice AdaptersQuickSpecs