ASRock H77 Pro4-M manual Specifications

1.2 Specifications

Platform	- Micro ATX Form Factor: 9.6-in x 9.6-in, 24.4 cm x 24.4 cm
	- All Solid Capacitor design (100% Japan-made high-quality
	Conductive Polymer Capacitors)
CPU	- Supports 3rd and 2nd Generation Intel® CoreTM i7 / i5 / i3 in
	LGA1155 Package
	- Digi Power Design
	- 4 + 2 Power Phase Design
	- Supports Intel® Turbo Boost 2.0 Technology
	- Supports Intel® K-Series unlocked CPU
	- Supports Hyper-Threading Technology (see CAUTION 1)
	- Supports Intel® Rapid Start Technology and Smart Connect
	Technology with Intel® Ivy Bridge CPU
Chipset	- Intel® H77
Memory	- Dual Channel DDR3 Memory Technology (see CAUTION 2)
	- 4 x DDR3 DIMM slots
	- Supports DDR3 1600/1333/1066 non-ECC, un-buffered
	memory (DDR3 1600 with Intel® Ivy Bridge CPU,
	DDR3 1333 with Intel® Sandy Bridge CPU)
	- Max. capacity of system memory: 32GB (see CAUTION 3)
	- Supports Intel® Extreme Memory Profile (XMP)1.3/1.2
Expansion Slot	- 1 x PCI Express 3.0 x16 slot (PCIE1: x16 mode)
	(see CAUTION 4)
	* PCIE 3.0 is only supported with Intel® Ivy Bridge CPU. With
	Intel® Sandy Bridge CPU, it only supports PCIE 2.0.
	- 2 x PCI Express 2.0 x16 slots (PCIE3: x1 mode;
	PCIE4: x4 mode)
	- 1 x PCI Express 2.0 x 1 slot
	- Supports AMD Quad CrossFireXTM and CrossFireXTM
Graphics	* Intel® HD Graphics Built-in Visuals and the VGA outputs can
	be supported only with processors which are GPU
	integrated.
	- Supports Intel® HD Graphics Built-in Visuals: Intel® Quick
	Sync Video, Intel® InTruTM 3D, Intel® Clear Video HD
	Technology, Intel® InsiderTM, Intel® HD Graphics 2500/4000,
	Intel® Advanced Vector Extensions (AVX)
	- Pixel Shader 5.0, DirectX 11 with Intel® Ivy Bridge CPU.
	Pixel Shader 4.1, DirectX 10.1 with Intel® Sandy Bridge
	CPU.
	- Max. shared memory 1760MB (see CAUTION 5)

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