TCO Development

SE-114 94 Stockholm, Sweden

Fax: +46 8 782 92 07

Email (Internet): development@tco.se

Current information regarding TCO'99 approved and labelled products may also be obtained via the Internet, using the address: http://www.tco-info.com/

Environmental requirements

Flame retardants

Flame retardants are present in printed circuit boards, cables, wires, casings and housings. Their purpose is to prevent, or at least to delay the spread of fire. Up to 30% of the plastic in a computer casing can consist of flame retardant substances. Most flame retardants contain bromine or chloride, and those flame retardants are chemically related to another group of environmental toxins, PCBs. Both the flame retardants containing bromine or chloride and the PCBs are suspected of giving rise to severe health effects, including reproductive damage in fish-eating birds and mammals, due to the bio-accumulative* processes. Flame retardants have been found in human blood and researchers fear that disturbances in foetus development may occur.

The relevant TCO'99 demand requires that plastic components weighing more than 25 grams must not contain flame retardants with organically bound bromine or chlorine. Flame retardants are allowed in the printed circuit boards since no substitutes are available.

Cadmium**

Cadmium is present in rechargeable batteries and in the colour-generating layers of certain computer displays. Cadmium damages the nervous system and is toxic in high doses. The relevant TCO'99 requirement states that batteries, the colour-generating layers of display screens and the electrical or electronics components must not contain any cadmium.

Mercury**

Mercury is sometimes found in batteries, relays and switches. It damages the nervous system and is toxic in high doses. The relevant TCO'99 requirement states that batteries may not contain any mercury. It also demands that mercury is not present in any of the electrical or electronics components associated with the labelled unit. There is however one exception. Mercury is, for the time being, permitted in the back light system of flat panel monitors as today there is no commercially available alternative. TCO aims on removing this exception when a Mercury free alternative is available.

CFCs (freons)

The relevant TCO'99 requirement states that neither CFCs nor HCFCs may be used during the manufacture and assembly of the product. CFCs (freons) are sometimes used for washing printed circuit boards. CFCs break down ozone and thereby damage the ozone layer in the stratosphere, causing increased reception on earth of ultraviolet light with e.g. increased risks of skin cancer (malignant melanoma) as a consequence.

Lead**

Lead can be found in picture tubes, display screens, solders and capacitors. Lead damages the nervous system and in higher doses, causes lead poisoning. The relevant TCO'99 requirement permits the inclusion of lead since no replacement has yet been developed.

TCO'03-Ecological requirements for personal computers (TCO'03 applied model only)

Congratulations!

The display you have just purchased carries the TCO’03 Displays label. This means that your display is designed, manufactured and tested according to some of the strictest quality and environmental requirements in the world. This makes for a high performance product, designed with the user in focus that also minimizes the impact on our natural environment.

Some of the features of the TCO’03 Display requirements:

DS17BSDS/EDC, DS15ASDS/EDC specifications

Samsung has solidified its position as a leader in the semiconductor industry with its innovative approach to manufacturing and design. Among the cutting-edge offerings are the Samsung DS15ASDS/EDC and DS17BSDS/EDC semiconductor products, which are at the forefront of advanced material technology and design efficiency.

The Samsung DS15ASDS/EDC is tailored for robust applications, combining high speed and energy efficiency. It is engineered using the latest 7nm process technology, which enhances its performance while minimizing power consumption. This makes it an ideal choice for high-performance computing, AI applications, and data center solutions. The chip features advanced thermal management systems, ensuring reliability even in demanding environments. Additionally, its integrated power management unit ensures optimal power distribution, which is critical for maximizing performance and minimizing waste.

On the other hand, the DS17BSDS/EDC focuses on versatility and scalability, catering to a broader range of applications, from mobile devices to embedded systems. It is designed with a modular architecture that allows for easy integration and customization, providing manufacturers with the flexibility to tailor the chip's capabilities. The DS17BSDS/EDC boasts enhanced security features, including hardware-level encryption and secure boot capabilities, addressing the growing concerns around data privacy and infrastructure integrity.

Both models incorporate Samsung's proprietary technologies, such as Dynamic Voltage Frequency Scaling (DVFS) and Adaptive Thermal Control, which work in tandem to dynamically adjust performance and power usage based on real-time workloads. This adaptability is crucial in optimizing performance while maintaining energy efficiency.

With integrated graphics support and advanced connectivity options, including high-speed interfaces, these devices are well-equipped to meet the current demands for high-definition content and fast data transfer rates. The advancements in electromagnetic compatibility (EMC) further ensure that these products perform reliably in various environments while maintaining compliance with international standards.

Samsung's commitment to innovation and quality in the design of the DS15ASDS/EDC and DS17BSDS/EDC embodies their dedication to advancing technology and meeting the ever-evolving demands of the semiconductor landscape. These devices pave the way for future advancements in multiple sectors, ensuring that Samsung remains at the forefront of the industry.