Texas Instruments DEM-DAI3010 manual EVM Important Notice

Page 3

EVM IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety measures typically found in the end product incorporating the goods. As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic compatibility and therefore may not meet the technical requirements of the directive.

Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.

TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.

TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.

Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM User’s Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For further safety concerns, please contact the TI application engineer.

Persons handling the product must have electronics training and observe good laboratory practice standards.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used.

Mailing Address:

Texas Instruments

Post Office Box 655303

Dallas, Texas 75265

Copyright 2003, Texas Instruments Incorporated

Image 3
Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions Figures Page Description DEM-DAI3010 Block DIagram Block DiagramInitial Setting at shipping Power Terminal CN057 Closed Default CN057 OpenUse of the DEM-DAI3010 Settings and Connections for Basic Operation SW/JP No Shape Setting FunctionsSCF1 SCF0 FMT1 FMT0CLK1 CLK0 Pdown DEMP1 DEMP0Emflg ADC Full-Scale Input Connector No DetailsDescription1-9 Page DEM-DAI3010 Printed-Circuit Board DEM-DAI3010 Schematics Printed-Circuit Board and SchematicDEM-DAI3010 Silkscreen DEM-DAI3010 Printed-Circuit BoardDEM-DAI3010-Top View DEM-DAI3010-Bottom View DIN Dout DEM-DAI3010 SchematicsDEM-DAI3010 Regulator, Connector and Ext.-I/F DEM-DAI3010 Digital Section Digital Audio Interface

DEM-DAI3010 specifications

The Texas Instruments DEM-DAI3010 is a highly versatile evaluation module designed to showcase the capabilities of the AIC3101 family of audio codecs. This module is particularly suited for engineers looking to explore audio processing applications in various consumer electronics, telecommunications, and automotive industries. The DEM-DAI3010 serves as a powerful platform for testing and integrating audio technologies into prototypes and final products.

One of the standout features of the DEM-DAI3010 is its high-performance audio processing capabilities. Equipped with a 24-bit audio data path and sampling rates of up to 192 kHz, the module ensures clear and high-fidelity sound reproduction. This feature makes the DEM-DAI3010 ideal for applications where sound quality is paramount, such as music playback systems, hearing aids, and professional audio equipment.

The DEM-DAI3010 utilizes Texas Instruments' advanced audio processing technologies, including programmable gain amplifiers, low-noise power supplies, and state-of-the-art digital signal processing (DSP). These technologies enable users to manipulate audio signals effectively, allowing for functions like audio mixing, equalization, and effects processing. Additionally, the module supports various audio formats, enhancing its adaptability to different project requirements.

Another characteristic of the DEM-DAI3010 is its user-friendly interface, which includes an I^2C control interface for seamless communication and configuration. This flexibility facilitates rapid prototyping and system integration, allowing engineers to test their designs quickly and efficiently. The integrated 3.5mm audio jacks provide easy connectivity for audio inputs and outputs, making it simpler to interact with the module during development phases.

Also noteworthy is its compatibility with even lower-powered microcontrollers, which makes it more suitable for portable applications. This ensures that projects can maintain high audio performance without compromising on power efficiency.

Overall, the Texas Instruments DEM-DAI3010 stands out as an essential tool for engineers and developers in the audio technology space. Its combination of high-quality audio processing, flexible interfaces, and compatibility with a range of devices positions it as a valuable resource for exploring and implementing advanced audio solutions. Whether for prototyping or as part of a finished product, the DEM-DAI3010 offers a robust platform to harness the power of modern audio technologies.