Texas Instruments SLOU121 manual Mute Shutdown/Mode, Signal Conditioning, Headphone Output Jack

Page 33

Using the TPA6011A4 EVM With the Plug-N-Play Evaluation Platform

3.3.3.1Signal Conditioning

The audio signal from the input jacks can be applied to the signal conditioning socket (U1) if an EVM is installed there, or socket U1 can be bypassed and the audio input signal applied directly to the inputs of the TPA6011A4.

-Switch S2 selects signal conditioning or bypasses it.

3.3.3.2Headphone Output Jack

Switch S3 is the source select for the stereo headphone output jack, J10. The headphone jack is capacitively coupled (via 470-F electrolytics) and can output either the signal from the headphone amplifier in socket U5, or the signal from the TPA6011A4 power amplifier installed in socket U2, as determined by the setting of headphone source select switch S3.

When S3 is set to the power amplifier position (U2 – U4), the headphone jack is connected to the TPA6011A4 power amplifier OUT+ output lines. When a plug is inserted into the jack, signals output through J10 are returned to platform ground, requiring single-ended power amplifier operation. A switch inside the headphone jack produces a control signal that can be routed to the power amplifier socket to shut down the TPA6011A4 EVM or switch it to single-ended output mode when a plug is inserted.

Source select switch S3 connects the headphone jack to the output lines of either the headphone amplifier socket U5, or the power amplifier sockets (U2 – U4).

-To keep the TPA6011A4 amplifier outputs separated, set switch S3 to the headphone amplifier position (U5) and use the speaker outputs (J7, J8, and J9).

-To route the TPA6011A4 amplifier outputs to the headphone output jack (J10), set switch S3 to the power amplifier position (U2 – U4). Uuse this setting only if the TPA6011A4 EVM is to drive single-ended loads con- nected to J10.

3.3.4Mute (Shutdown)/Mode

The TPA6011A4 EVM is equipped with a shutdown control input pin. When this input is pulled to ground, the TPA6011A4 amplifier IC on the module enters the shutdown mode and dissipates very little power. While in the shutdown mode, the PC BEEP input is still active. When the EVM control input is tied to GND or allowed to float, normal amplifier operation resumes.

In typical applications, as often found in notebook computers, portable audio products, and such, the internal speakers mute when headphones are plugged into the headphone jack, or internal speakers mute when external speakers are connected. In applications using separate speaker and headphone amplifiers, the one not being used can be shut down to conserve power.

A mode control input pin on the EVM switches the TPA6011A4 amplifier IC between the bridge-tied load (BTL) output mode and the single-ended (SE)

Details 3-13

Image 33
Contents User’s Guide Important Notice EVM Important Notice EVM Warnings and Restrictions Information About Cautions and Warnings Read This FirstRelated Documentation From Texas Instruments Contents Tables FiguresIntroduction Feature Highlights Description TPA6011A4 EVM SpecificationsIntroduction EVM JP6 JP7 Quick StartPower PrecautionsPlatform Preparations Quick Start List for PlatformModule Preparation Typical TPA6011A4 EVM Jumper Settings Quick Start Module Map Quick Start List for Stand-AloneControl Inputs Quick Start Quick Start Details TI Plug-N-Play Audio Amplifier Evaluation Platform TPA6011A4 EVM TPA6011A4 Audio Power Amplifier Evaluation Module1 TPA6011A4 Audio Amplifier IC TPA6011A4 EVM Schematic DiagramInputs and Gain Volume ControlBlock Diagram of SE Volume Control DC Volume Control BTL Mode, VDD = 5 Differential Input Depop Circuitry BTL OperationSingle-Ended Operation 2 TPA6011A4 Module Jumper Settings and Switches Installing and Removing EVM BoardsEVM Insertion EVM Removal2.2 J1 Output Mode Jumper 2.1 S1 Shutdown Switch2.3 J2 Input Mode Jumper Signal Routing2.4 J3 Input and Output Mode Jumper 2.5 J4 Fade Mode JumperSignal Conditioning Mute Shutdown/ModeHeadphone Output Jack Headphone Jack Control Signals Mute/Mode Select JP6Mute/Mode Polarity Select JP8 Power Requirements Inputs and Outputs InputsOutputs 1 TPA6011A4 EVM Connected for BTL Output Using the TPA6011A4 EVM Stand-Alone11. TPA6011A4 EVM Connected for Stereo Single-Ended Output 2 TPA6011A4 EVM Connected for Single-Ended OutputReference Reference TPA6011A4 EVM Layers and Board SchematicTPA06011A4 EVM Schematic Diagram TPA6011A4 EVM Parts List TPA6011A4 EVM Parts List

SLOU121 specifications

Texas Instruments SLOU121 is a comprehensive technical document that serves as a guide for the evaluation and implementation of various TI products. This document highlights the operational capabilities, design considerations, and practical applications of TI’s semiconductor solutions, with a focus on enabling engineers and designers to optimize their designs effectively.

One of the main features of SLOU121 is its emphasis on performance. It provides detailed specifications and operational data that help users understand the key parameters of TI products, such as voltage levels, current ratings, and thermal characteristics. This information is crucial for engineers as they design circuits that require precision and reliability.

The document also covers various technologies that Texas Instruments employs in its semiconductor solutions. These technologies include advanced CMOS processes, which enable high integration and low power consumption. Additionally, the use of innovative materials and structures enhances the performance and efficiency of the components, thereby providing manufacturers with the tools they need to create cutting-edge electronics.

Another important characteristic of SLOU121 is its user-friendly layout and structure. Information is organized in a manner that allows for quick referencing, which is essential for busy engineers who need to find specific data efficiently. The inclusion of diagrams, graphs, and tables further aids in visualizing the performance metrics and operational limits of the devices discussed.

Moreover, SLOU121 delves into specific applications where TI products excel. These applications range from automotive systems to industrial automation and consumer electronics. The guide also addresses compatibility with industry standards and protocols, which is vital for integration into existing systems.

In addition to technical specifications, the document provides guidance on practical implementation strategies. This includes best practices for layout design, thermal management, and component selection. By incorporating these recommendations, engineers can mitigate potential issues during the design phase and ensure that their final products meet or exceed performance expectations.

Overall, Texas Instruments SLOU121 is an essential resource that combines technical knowledge with practical advice, helping engineers to leverage TI technologies for innovative product development. By providing a thorough understanding of features, technologies, and recommendations, SLOU121 equips designers with the necessary tools to create high-performance electronic solutions.