Texas Instruments SLOU106 manual General High-Speed Amplifier Design Considerations

Page 25

Chapter 3

General High-Speed Amplifier Design Considerations

The THS4140 EVM layout has been designed for use with high-speed signals and can be used as an example when designing PCBs incorporating the THS4140. Careful attention has been given to component selection, grounding, power supply bypassing, and signal path layout. Disregarding these basic design considerations could result in less than optimum performance of the THS4140 high-speed operational amplifier.

Surface-mount components were selected because of the extremely low lead inductance associated with this technology. This helps minimize both stray inductance and capacitance. Also, because surface-mount components are physically small, the layout can be very compact.

Tantalum power supply bypass capacitors at the power input pads help supply currents needed for rapid, large signal changes at the amplifier output. The 0.1-∝F power supply bypass capacitors were placed as close as possible to the IC power input pins in order to minimize the return path impedance. This improves high frequency bypassing and reduces harmonic distortion.

A proper ground plane on both sides of the PCB should be used with high-speed circuit design. This provides low-inductive ground connections for return current paths. In the area of the amplifier input pins, however, the ground plane should be removed to minimize stray capacitance and reduce ground plane noise coupling into these pins. This is especially important for the inverting pin while the amplifier is operating in the noninverting mode. Because the voltage at this pin swings directly with the noninverting input voltage, any stray capacitance would allow currents to flow into the ground plane. This could cause possible gain error and/or oscillation. Capacitance variations at the amplifier input pin of greater than 1 pF can significantly affect the response of the amplifier.

In general, it is best to keep signal lines as short and as straight as possible. Incorporation of microstrip or stripline techniques is also recommended when signal lines are greater than 1 inch in length. These traces must be designed with a characteristic impedance of either 50 Ω or 75 Ω, as required by the application. Such a signal line must also be properly terminated with an appropriate resistor.

3-1

Page 24 Page 26
Image 25
Page 24 Page 26
Contents Users Guide Important Notice Preface Trademarks Contents Figures Introduction and Description Description Evaluation Module FeaturesSchematic of the Populated Circuit Default Configuration THS4140 EVM Specifications±2. Schematic THS4140 EVM SchematicAdditional Sample Schematics ±5. Vicr Level Shifter ±7. Top Layer Silkscreen THS4140 EVM Layout±9. Internal Plane Layer 2 Ground Plane ±11. Bottom Layer 4 Ground and Signal Introduction and Description Using the THS4140 EVM Required Equipment Power Supply Setup±2. Signal Connections Input and Output Setup±3. Driver 1 Output Signal Testing the EVM SetupMeasuring the Frequency Response Power Down VerificationButterworth Filter Butterworth Filter±1. THS4140 EVM Bill of Materials THS4140 EVM Bill of MaterialsP374CTR-ND General High-Speed Amplifier Design Considerations General High-Speed Amplifier Design Considerations

SLOU106 specifications

Texas Instruments (TI) offers a diverse array of semiconductor products, one of which is the SLOU106, a comprehensive technical document or application report. This document is crucial for engineers and designers working with TI’s various analog and embedded processing products.

The SLOU106 document provides deep insights into the capabilities and functionalities of TI's diverse product offerings, built around their mission to empower innovation in the field of electronics. One of the main features highlighted in SLOU106 includes detailed design guidance and application notes that help engineers optimize circuit designs. These often include layout considerations, signal integrity aspects, and component selection criteria, thereby ensuring that users achieve the best performance from TI’s devices.

Another significant aspect covered in the SLOU106 is the integration of advanced technologies. TI aims to equip its products with state-of-the-art features such as low power consumption, high efficiency, and robust performance. The document discusses how these technologies can lead to smaller footprints in designs, which is vital for portable and compact applications. For instance, utilizing Digital Signal Processing (DSP) and various control techniques allows engineers to harness the full potential of TI's processors in applications ranging from automotive to industrial automation.

The document also emphasizes TI’s commitment to sustainability and environmental responsibility through its products. There are insights into power management technologies that help reduce energy consumption while maintaining performance, which is particularly relevant as industries shift towards greener solutions.

Moreover, SLOU106 provides valuable case studies and examples showcasing real-world applications, which help in bridging the gap between theory and practice. These practical insights are indispensable for engineers who seek to leverage TI’s technology in their unique applications.

In conclusion, the Texas Instruments SLOU106 document stands as a vital tool for engineers, providing in-depth information about product features, cutting-edge technologies, and practical design strategies. By utilizing the insights provided in this document, users can optimize their designs and effectively leverage TI's products to achieve innovative solutions across a myriad of applications.
Top Page Image Contents