Marantz SA-17S1 service manual Q124 CXD1882R, Cd Dsp

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Q124 : CXD1882R

Pin Description

The pin descriptions by function are given below.

1.Read Channel Block (22 pins) 1-1. PLL (8 pins)

(1)PDHVCC (VC input for PD Hi-Z output)

Midpoint potential input for RFPLL. If the HPDVC bit (bit 6) of the RFPLL1 register (E0h) is set to “1”, the voltage input to this pin is output from the PDO pin when the PDO pin output is other than VCC or GND. This pin sharpens the PDO pin output waveform in order to reduce phase deviation.

(2)PDO (phase detector output: output) Phase comparator charge pump output.

(3)FDO (frequency detector output: output) Frequency comparator charge pump output.

(4)LPF1 (PLL LPF1: input)

Inverted input of the operational amplifier of the PLL loop filter.

(5)LPF2 (PLL LPF2: input)

When the LPFTGN bit (bit 0) of the LOOPFCTL register (EAh) is set to “1”, this pin is connected to the inverted input of the operational amplifier of the PLL loop filter. It is used to switch the PLL loop gain.

(6)LPF5 (PLL LPF5: output)

Output of the operational amplifier of the PLL loop filter.

(7)VCOIN (VCO input: input)

VCO input. When using the built-in operational amplifier, the output of the second operational amplifier of the loop filter is connected to this pin.

(8)VCOR1 (VCO resistor: input)

Connects the VCO oscillation range setting resistor. The setting resistor is connected between his pin and GND. When R2 is increased, the minimum oscillation frequency is reduced.

1-2: RF binary setting (6 pins)

(1)RFDCC (RF DC cut control: input)

Input for adjusting the RF signal DC cut HPF. A resistor is connected between this pin and the midpoint potential in order to raise the HPF cut-off frequency in areas other than the linking section.

(2)ASF[2:1] (asymmetry compensation filter: output)

Connects the filter for switching the asymmetry compensation time constant in the linking section.

(3)DASYO (data output of asymmetry compensation circuitry: output)

RF binary signal output.

(4)DASYI (data input of asymmetry compensation circuitry: input) Input for the analog signal obtained by integrating the RF binary signal.

(5)RFIN (RF input: input) RF signal input.

1-3. CLV (6 pins)

(1)MDSOUT (MDS output: output)

Built-in CLV circuit frequency error output.

(2)MDPOUT (MDP output: output) Built-in CLV circuit phase error output.

(3)MDPIN[2:1] (MDP input: input)

MDP inputs. The input from these two pins is switched by the MDPSL bit (bit 0) of the SPDLCTL register (E8h). MDSOUT and MDPOUT are synthesized as analog values and input to one of these pins. A spindle control signal generated by an external spindle control circuit is input to the other pin.

(4)SPO (spindle control output: output)

Spindle control output. It attenuates and outputs the signal input from MDPIN.

(5)CLVS (CLVS control output: output)

Control output for switching the spindle control filter constant in CLVS mode.

1-4. Other pins (2 pins)

(1)LINK/DEFECT (LINK monitor/DEFECT: input/output)

LINK signal monitor output or DEFECT input signal. The signal is switched by the LNDFT bit (bit 7) of the MNTRPIN register ($Efh). For LINK output, this pin is set high in the linking section

processing mode for DVD + RW discs. For DEFECT input, an external high signal is input during the DEFECT period.

(2)APEO (absolute phase error: output)

Absolute phase error signal. It is integrated and used to evaluate the quality of the read channel.

2.CD-ROM Interface (12 pins)

Interface between this IC and a Sony CD signal processing IC such as the CXD3011R.

(1)MDAT (medium data: input)

Serial data stream from the CD signal processing IC (hereafter referred to as “CD DSP”).

(2)BCLK (bit clock: input)

Bit clock input signal from the CD DSP. It strobes the MDAT signal.

(3)LRCK (LR clock: input)

LR clock input signal from the CD DSP. It indicates MDAT signal left channel and right channel.

(4)C2PO (C2 pointer: input)

C2 pointer input signal from the CD DSP. It indicates that the MDAT signal contains an error.

(5)WFCK (write frame clock: input)

Write frame clock input signal from the CD DSP.

(6)SCOR (subcode sync OR: input)

Subcode sync input signal from the CD DSP.

(7)SBIN (subcode serial input: input)

Subcode serial input signal from the CD DSP.

(8)EXCK (external clock: output)

Clock output for reading the SBIN signal which is sent to the

CD DSP.

(9)GRSOR (guard SCOR: input)

Guarded SCOR input signal from the CD DSP.

(10)XRCI (RAM overflow input: input)

CD DSP RAM overflow input signal.

3. Buffer Memory Interface (32 pins)

This interface can be connected with a 4M-bit or 16M-bit EDO DRAM. Note that the bus width is 16 bits.

(1)XMWR (DRAM write enable: output)

DRAM write enable negative logic output signal.

(2)XCAS (column address strobe: output)

Column address strobe negative logic output signal.

(3)XRAS (row address strobe: output)

Row address strobe negative logic output signal.

(4)XMOE (memory output enable: output)

DRAM output enable negative logic output signal.

(5)MA[11:0] (DRAM address: output)

DRAM address outputs. When connected to a 4M-bit DRAM, the MA[11:9] pins can be used as monitor pins.

(6)MDB[F:0] (DRAM data bus: input/output) DRAM data bus.

4.Sub CPU Interface (22 pins)

(1)XWR (sub CPU write: input)

Strobe negative logic input signal for writing internal registers.

(2)XRD (sub CPU read: input)

Strobe negative logic input signal for reading internal register status.

(3)D[7:0] (sub CPU data bus: input/output)

8-bit data bus.

(4)A[7:0] (sub CPU address: input)

Address input signals for selecting internal registers from the sub CPU.

(5)XINT0, 1 (sub CPU interrupt: output)

Interrupt request negative logic output signals for the sub CPU. Interrupt requests from the decoder block and authentication block are output from the XINT0 pin. Interrupt requests from the read channel block are output from the XINT1 pin. These are open drain outputs.

(6)XCS (chip select: input)

Chip select negative logic signal from the sub CPU.

(7)XWAT (wait: output)

Negative logic output wait signal used by the sub CPU to access the buffer memory.

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Contents SA-17S1 Canada USAEurope / Trading AmericasTechnical Specifications Reset the unit to the default settings Service ModeFactory mode Press PHANTOM-CTaking the Disc OUT of Emergency Page Block Diagram Power and Muting Schematic DiagramPower and D/A Convertor DIG OUTJ708 Surround Channel DAC/LPF AudioJ707 Surround J407 CenterPV16 Servo 1/3 DVD Decord Control MPU PV16 Servo 3/3 IR Senser OUTPF16 Parts LocationPO16 PA16 PR16 PY16PP16 PV16 Microprocessor and IC Data Q116 CXD3068QQ126 TC74VHC157 Servo DSP PWM GeneratorOutput Pins Q101 CXD1881R Pin Description Power Supply PinsInput Pins Serial Port PinsAnalog Pins Q101 CXD1881RQ123 CXD2752R Zdfl PhrefiPhrefo DsalWavss WarfiWavrb DQ7Dsal FE WarfDsal S PhrefQ124 CXD1882R CD DSPHost Interface 31 pins RF I N Q125 GXPQ7100MASK QD41/QD61/QD71 CS4397 RST Description DescriptionAOUTL+ Hardware ModeControl Port Mode QF01 MB90F553A Exploded View and Parts List Packing Not Standard Spare PartsMecha Loader Assy Ceramic CAP Electrical Parts ListANT. Antenna CAP. Capacitor CONN. Connecting HP Headphone Electroly CAPCircuit Board PA16-RESISTORS CommonDiode POS Vers DescriptionPA16-SEMICONDUCTORS Shottky 11EQS10 1APO16-SEMICONDUCTORS PP16-POWER IN/MUTE/±12VPA16-MISCELLANEOUS PR16-RESISTOR PP16-SEMICONDUCTORSPR16-HEADPHONE Circuit Board PR16-CAPACITORS PR16-SEMICONDUCTORSCER. Chip For EUR MJIChip MCR03EZHUJ202 ChipChip MCR03EZHUJ363 POS. Vers No Color PY16-FRONT Circuit Board PV16-SEMICONDUCTORSPV16-MISCELLANEOUS PY16-SEMICONDUCTORSSkhvbf 260GF RED SP01012030 Push SwitchPY16-MISCELLANEOUS HQ31301920 Display Unit FTD CM2059C

SA-17S1 specifications

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