Intel BLKDX79SI manuals
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4 pages 468.35 Kb
ATX Form Factor 1 Primed and ReadyBuild Upon a Winner The Boxed Intel® Desktop Board DX79SI Solution Includes: Power for the Hottest New Games Software Included: 2 1 Support for the Intel® Core™processor Extreme Edition in the LGA2011 package: Supports both 4 core and 6 core processors. Features Intel® Turbo Boost Technology,2 Intel® Hyper Threading Technology3 for exceptional performance and Performance and reliability with support for RAID 0, 1, 5, 10, and integrated audio that rivals the performance of high-end 16Solid-Statecapacitors and exclusive Power Supervisor: 18ATX (9.6¨ x 11.6¨) Form Factor: ATX board supports more fully featured tower designs Smart Cache, enabling dynamic and efficient allocation of cache 2 Intel® X79 Express Chipset: Features DMI uni-directional connectivity to the processor 3 Eight DIMM slots: Designed to O.C.4 memory, delivering up to GB/s memory bandwidth Four Super Speed USB 3.0 ports two IEEE 1394a ports (1 external 1 via internal header), and 14 USB 2.0 ports (6 back ports 5Three PCI Express 3.0* x16 slots: 6PCI Express* and PCI connectors: 10Dual Intel® Gigabit Ethernet LAN: Features onboard 10/100/1000 Mb/s Ethernet LAN connectivity 14Initialization and diagnostic LEDs: Provides instant visible system feedback (24.38 cm) 3 ProcessorProcessor Support •Intel® Turbo Boost Technology2 •Intel® Hyper-ThreadingTechnology3 SDRAM •Intel® Fast Memory Access •Supports Intel® 64 architecture5 Chipset Intel® X79 Express Chipset •Intel® X79 PCH •Intel® Rapid Storage Manager (RAID 0, 1, 5, 10) USB Ports •Six Hi-SpeedUSB 2.0 ports via back panel •Eight additional Hi-SpeedUSB 2.0 ports via four internal headers System BIOS •Advanced configuration and power interface V3.0b, DMI fast boot •Fast boot •Intel® Express BIOS update support: BIOS update via F7 function key Hardware Management Features •Processor fan speed control •System chassis fan speed control •Voltage and temperature sensing •Fan sensor inputs used to monitor fan activity •Power management support for ACPI 3.0b Intel® PRO 10/100/1000 Network Connection •Dual Intel® LAN on the back panel •New low-powerdesign can meet Energy Star* 5.0 specifications Expansion Capabilities •Two PCI Express 2.0 x1 slots •One PCI slot Audio •10-channelIntel® High Definition Audio6 codec •8-channelvia the back panel •2-channelvia the front panel •Back panel support for output via optical cable •One internal header for S/PDIF output for HDMI* support System Memory Memory Capacity Eight •Maximum system memory up to 64 GB7 using 8 GB double-sidedDIMMs Memory Types •DDR3 2400+ O.C. SDRAM memory support •Non-ECCMemory Memory Modes •Quad- or tri- or dual- or single-channeloperation support Memory Voltage •1.35 V low voltage •1.5 V standard JEDEC voltage •Support for Intel® XMP extended voltage profiles Jumpers and Front Panel Connectors Jumpers •Single configuration jumper design •Jumper access for BIOS maintenance mode Front Panel Connectors •Reset, HD LED, Power LEDs, power on/off •Four front-panel Hi-SpeedUSB 2.0 headers •One front-panel Super-SpeedUSB 3.0 headers •Front-panelaudio header •One IEEE 1394a header Mechanical Board Style •ATX Board Size •ATX 12 Environment Operating Temperature •0° C to +55° C Storage Temperature •–20°C to +70° C Regulations and Safety Standards United States and Canada UL 1950, Third edition—CAN/CSAC22.2 No. 950-95with recognized U.S. and Canadian component marks Europe United States FCC Part 15, Class B FCC Part 15, Class B open-chassis(cover off) testing Canada ICES-003,Class B Europe EMC directive 89/336/EEC; EN 55022:1998 Class B; EN 55024:1998 Australia/New Zealand AS/NZS 3548, Class B Taiwan CNS 13438, Class B International CISPR 22:1997, Class B 4 For ordering information, visit www.intel.comFor the most current product information, visit www.intel.com/go/idb
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