Intel® Desktop Board DX79SI Extreme Series

Technical Specifications

ProcessorProcessor Support

•Intel® Core™ i7 processors in the LGA2011 package

•Intel® Turbo Boost Technology2•Intel® Hyper-Threading Technology3

•Integrated Memory Controller with support for up to 64 GB4 of system memory DDR3 2400+ O.C.

SDRAM•Intel® Fast Memory Access•Supports Intel® 64 architecture5ChipsetIntel® X79 Express Chipset•Intel® X79 PCH•Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)

•Two SATA (6.0 Gb/s) and four SATA (3.0 Gb/s) ports

USB Ports•Six Hi-Speed USB 2.0 ports via back panel•Eight additional Hi-Speed USB 2.0 ports via four internal headers

•Four Super-Speed USB 3.0 ports via NEC controller

System BIOS

•64 Mb Flash EEPROM with Intel® Platform Innovation Framework for EFI Plug and Play, IDE drive auto-configure

•Advanced configuration and power interface V3.0b, DMI 2.5fast boot•Fast boot•Intel® Express BIOS update support: BIOS update via F7 function key
Hardware Management Features•Processor fan speed control•System chassis fan speed control•Voltage and temperature sensing•Fan sensor inputs used to monitor fan activity•Power management support for ACPI 3.0bIntel® PRO 10/100/1000Network Connection•Dual Intel® LAN on the back panel•New low-power design can meet Energy Star* 5.0 specificationsExpansion Capabilities

•Three PCI Express* x16 connectors (configured as x16/x8/x8 in Tri graphics mode)

•Two PCI Express 2.0 x1 slots•One PCI slotAudio•10-channel Intel® High Definition Audio6 codec•8-channel via the back panel•2-channel via the front panel•Back panel support for output via optical cable•One internal header for S/PDIF output for HDMI* supportSystem MemoryMemory Capacity

•Eight 240-pin DIMM connectors supporting quad channel memory. Two double-sided DIMMS per channel

•Maximum system memory up to 64 GB7 using 8 GB double-sided DIMMs
Memory Types•DDR3 2400+ O.C. SDRAM memory support•Non-ECC MemoryMemory Modes•Quad- or tri- or dual- or single-channel operation supportMemory Voltage•1.35 V low voltage•1.5 V standard JEDEC voltage•Support for Intel® XMP extended voltage profilesJumpers and Front Panel ConnectorsJumpers•Single configuration jumper design•Jumper access for BIOS maintenance modeFront Panel Connectors•Reset, HD LED, Power LEDs, power on/off•Four front-panel Hi-Speed USB 2.0 headers•One front-panel Super-Speed USB 3.0 headers•Front-panel audio header•One IEEE 1394a headerMechanicalBoard Style•ATXBoard Size

•11.6¨ x 9.6¨ (29.46 cm x 24.38 cm) Baseboard Power Requirements

•ATX 12 V
EnvironmentOperating Temperature•0° C to +55° CStorage Temperature•–20° C to +70° CRegulations and Safety StandardsUnited States and CanadaUL 1950, Third edition—CAN/CSA C22.2No. 950-95 with recognized U.S. and Canadian component marksEurope

Nemko certified to EN 60950 International Nemko certified to IEC 60950

(CB report with CB certificate) EMC Regulations (tested in representative chassis)

United States FCC Part 15, Class BFCC Part 15, Class B open-chassis (cover off) testing CanadaICES-003, Class B EuropeEMC directive 89/336/EEC; EN 55022:1998 Class B; EN 55024:1998Australia/New ZealandAS/NZS 3548, Class BTaiwanCNS 13438, Class B InternationalCISPR 22:1997, Class B

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