ADC Broadband System 51

ADCP-61-471 • Issue 4 • June 2000 • Section 2: Operation and Maintenance

DLP-501

Page 1 of 2

CHASSIS INSPECTION

Summary: This procedure provides instructions for identifying the Soneplex Broadband chassis and module locations. The chassis front and locations for modules are shown in Figure 501-1. The chassis backplane is shown in Figure 501-2 .

1.See Figure 501-1to identify module locations at the front of the chassis. A working DS3 MUX module, an APU, and an MPU are always required. The slots identified for low- speed modules can house:

•Up to 14 ODS2 modules (7 working and 7 protect),

•28 HLXC modules,

•28 DLX modules,

•28 RLX modules, or

•Any combination up to a maximum of 28 DS1 circuits.

2.See Figure 501-2to identify components and locations on the chassis backplane.

Stop! You have completed this procedure.

LOW SPEED UNITS

HSW HSP MXW MXP TAU 1-1 1-3 2-1 2-3 3-1 3-3 4-1 4-3 5-1 5-3 6-1 6-3 7-1 7-3 APU

RTAU

1-2 1-4 2-2 2-4 3-2 3-4 4-2 4-4 5-2 5-4 6-2 6-4 7-2 7-4 MPU

5915-B

DS3 MUX

RTAU

UNITS

MODULE

Figure 501-1. Soneplex Broadband Chassis, Front View

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