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| APES | Requirement | IT | Blue | TCO '03 | ECMA | ||
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(Apple's Product Environmental Specifications) | Yes | No | Not | ('02) | Desktop | Desktop | (6/99) | ||||
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| CPUs | Display |
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2.24 | Information on the ability to change/upgrade components is | X |
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| included in the product documentation |
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2.25 | Design allows for installation, expansion exchange, upgrade, or |
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| P6.10 | 4.4, C.3 |
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| attachment of a mass storage unit |
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3.0 | Banned/restricted materials |
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3.1 | CFCs and HCFCs are not present in the product | X |
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| No substances included in annex A, B or C of the Montreal Protocol |
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3.2 | on Substances that Deplete the Ozone Layer are used in the | X |
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manufacture of the printed wiring boards, assembly of the Printed |
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| Wiring Boards and final assembly of the product |
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3.3 | Asbestos, PCB and PCT are not present in the product. | X |
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3.4 | Mercury is not present in the product (with the exception of mercury | X |
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in flat panel backlighting) |
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| Connections to be separated during disassembly of FPD must be |
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3.5 | easy to take apart in order to not damage the mercury lamps. This | X |
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| make removal of the lamps complicated. |
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| Mercury (Hg) in flat panel display backlight bulb(s): |
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| __1.8_ mg (minimum) |
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3.6 | __3.0_ mg (average) | « Values |
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| __3.5_ mg (maximum) |
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| __16_ number of backlight bulbs |
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| Brominated and chlorinated flame retardants, PBB and PBDEs are |
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3.7 | not present in mechanical plastic parts heavier than | X |
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| X 25 g / ___ 50 g |
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3.8 | No PCB (polychlorinated biphenyls) or PCT (polychlorinated | X |
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| terphenyls) are present in product |
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| The base material of Printed Wiring Board must not contain any |
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3.9 | PBB (polybrominated biphenyls), PBDE (polybrominated diphenyl | X |
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| 3.1.2.2 |
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| ethers) or chlorinated paraffins |
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| Plastic components weighing more than 25 grams shall not contain |
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3.10 | flame retardants that contain organically bound chlorine or bromine. | X |
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| A.6.2.3 |
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| The flame retardant threshold value is 0.5 weight percent. |
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| A list of all plastic components in the product that weigh >25 grams |
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| shall be given. The list shall include information regarding use of |
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3.11 | flame retardants. CAS# and FR type must be provided for flame | X |
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| A.6.2.4 |
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retardant concentrations over 0.5 weight percent. Part of the |
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| information can, for secrecy reasons, be sent directly from the |
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| plastic manufacturer to TCO certified lab. |
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| Plastic parts that weight more than 25 grams in the VDU shall not |
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3.12 | contain chlorine or bromine as a part of the polymer; i.e. polyvinyl | X |
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| A.6.2.5 |
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| chloride (PVC) |
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3.13 | No antimony trioxide (Sb2O3) flame retardants are used in plastic | X |
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| enclosure resins |
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3.14 | No cadmium (Cd) or cadmium compounds & lead (Pb) or lead | X |
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| compounds are intentionally added to cable enclosures |
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3.15 | Cadmium (Cd) and lead (Pb) are not present in mechanical plastic | X |
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| parts heavier than |
| X 25 g / __50g |
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3.16 | Cadmium is not present in the CRT (Cathode Ray Tube) |
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3.17 | No mercury (Hg) or cadmium (Cd) in electronic components | X |
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| A.6.2.1 | 5.8 | |||
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| Paint, lacquer, plastic parts, connectors, batteries, and solder in the |
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3.18 | VDU shall not contain cadmium (Cd) or mercury (Hg). The | X |
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| A.6.2.1 |
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| threshold value per listed part is 2 ppm for mercury and 5 ppm for |
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| cadmium. |
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| Batteries, paint, lacquer, external cables, plastic materials and |
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3.19 | external adaptors belonging to the VDU shall not contain lead (Pb). | X |
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| A.6.2.2 |
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| The threshold value is 50 ppm per weight per listed part |
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3.20 | Paints and inks used in the product are free from cadmium (Cd) | X |
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| P1.4 |
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| and lead (Pb) |
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| Chloroparaffins with chain length |
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3.21 | greater than 50% are not present in mechanical plastic parts | X |
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| 5.8 | |||
| heavier than | X 25g / __50g |
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3
