M3A78-EM Motherboard Qualified Vendors Lists (QVL). DDR2-1066 MHz capability

 

 

 

 

 

SS/

DIMM support

Size

Vendor

Part No.

CL

Chip Brand

Chip No.

(Optional)

 

 

 

 

 

 

DS

A*

B*

C*

512MB

Kingston

KVR1066D2N7/512

N/A

Elpida

SS

E5108AJBG-1J-E

1G

Kingston

KHX8500D2/1G

N/A

Kingston

DS

Heat-Sink Package

1G

Qimonda

HYS64T128020EU-19F-C

6

Qimonda

DS

HYB18T512800CF19FFSS24313

1G

Kingmax

KLED48F-A8K15

N/A

Kingmax

DS

KKA8FFIXF-JFS-18A

1G

Transcend

TX1066QLJ-2GK1GB

5

Transced

DS

Heat-Sink Package

1G

OCZ

OCZ2N1066SR2DK

N/A

OCZ

DS

Heat-Sink Package

1G

GEIL

GE22GB1066C5DC

5

GEIL

DS

Heat-Sink Package

1G

GEIL

GE24GB1066C5QC

5

GEIL

DS

Heat-Sink Package

Due to AMD CPU limitation, DDR2 1066 is supported by AM2+ CPU for one DIMM per channel only. Refer to www.asus.com for the supported CPU models.

DDR2-800 MHz capability

 

 

 

 

 

SS/

DIMM support

Size

Vendor

Part No.

CL

Chip Brand

Chip No.

(Optional)

 

 

 

 

 

 

DS

A*

B*

C*

1G

Kingston

KHX6400D2LL/1G

N/A

Kingston

DS

Heat-Sink Package

512MB

Kingston

KVR800D2N5/512

N/A

Promos

SS

V59C1512804QCF25SY032406PECPA

2G

Kingston

KHX6400D2/2G

N/A

Kingston

DS

Heat-Sink Package

4G

Kingston

N/A

N/A

Elpida

DS E2108ABSE-8G-E

512MB

Samsung

M378T6553GZS-CF7

6

Samsung

SS

K4T51083QG-HCF7

2G

Samsung

M37875663QZ3-CF7

6

Samsung

DS

K4T1G084QQ-HCF7

2G

Samsung

M391T5663QZ3-CF7

6

Samsung

DS

K4T1G084QQ-HCF7(ECC)

512MB

Qimonda

HYS64T64000EU-2.5-B2

6

Qimonda

SS

HYB18T512800B2F25FSS28380

1G

Micron

MT9HTF12872AY-800E1

6

Micron

SS

D9HNP 7YE22(ECC)

1G

Corsair

XMS2-6400

4

Corsair

DS

Heat-Sink Package

512MB

HY

HYMP564U64CP8-S5 AB

5

Hynix

SS

HY5PS12821CFP-S5

1G

HY

HYMP512U64CP8-S5 AB

5

Hynix

DS

HY5PS12821CFPS5

512MB

Kingmax

KLDC28F-A8KI5

N/A

Kingmax

SS KKA8FF1XF-JFS-25A

1G

Kingmax

KLDD48F-A8K15

N/A

Kingmax

DS KKA8FFIXF-HFS-25A

512MB

Apacer

78.91G91.9K5

5

Apacer

SS

AM4B5708JQJS8E0751C

2G

Apacer

78.A1GA0.9K4

5

Apacer

DS

AM4B5808CQJS8E0740E

512MB

Transcend

TS128MLQ64V8J512MB

N/A

Micron

SS

7HD22 D9GMH

1G

Transcend

505485-1034

5

Transcend

DS

TQ123PJF8F0801

512MB

VDATA

M2GVD6G3H3160Q1E52

N/A

VDATA

SS

VD29608A8A-25EG20813

1G

ADATA

M2OAD6G314170Q1E58

N/A

ADATA

DS

AD29608A8A-25EG80810

2G

PSC

AL8E8F73C-8E1

5

PSC

DS

A3R1GE3CFF734MAA0E

2G

PSC

AL7E8E63H-10E1K

5

PSC

DS

A3R1GE3CFF750RABBP(ECC)

1G

GEIL

GX22GB6400DC

5

GEIL

DS

Heat-Sink Package

2G

GEIL

GE28GB800C5QC

5

GEIL

DS

Heat-Sink Package

1G

Super Talent

T800UB1GC4

4

Super Talent

DS

Heat-Sink Package

1G

G.SKILL

F2-6400CL4D-2GBPK

4

G.SKILL

DS

Heat-Sink Package

2G

G.SKILL

F2-6400CL5D-4GBPQ

5

G.SKILL

DS

Heat-Sink Package

4G

G.SKILL

F2-6400CL5Q-16GNQ

5

G.SKILL

DS

Heat-Sink Package

 

1G

OCZ

OCZ2VU8004GK

6

OCZ

DS

Heat-Sink Package

1G

Elixir

M2Y1G64TU8HB0B-25C

5

Elixir

DS

N2TU51280BE-25C802006Z1DV

1-18

Chapter 1: Product introduction