Asus M3A78-EM M3A78-EMMotherboard Qualified Vendors Lists (QVL). DDR2-1066MHz capability, DDR2-800MHz capability

M3A78-EM Motherboard Qualified Vendors Lists (QVL). DDR2-1066 MHz capability

					SS/	DIMM support
Size	Vendor	Part No.	CL	Chip Brand		Chip No.	(Optional)
					DS	A*	B*	C*
512MB	Kingston	KVR1066D2N7/512	N/A	Elpida	SS	E5108AJBG-1J-E	•	•
1G	Kingston	KHX8500D2/1G	N/A	Kingston	DS	Heat-Sink Package	•	•
1G	Qimonda	HYS64T128020EU-19F-C	6	Qimonda	DS	HYB18T512800CF19FFSS24313	•	•
1G	Kingmax	KLED48F-A8K15	N/A	Kingmax	DS	KKA8FFIXF-JFS-18A	•	•
1G	Transcend	TX1066QLJ-2GK1GB	5	Transced	DS	Heat-Sink Package	•	•
1G	OCZ	OCZ2N1066SR2DK	N/A	OCZ	DS	Heat-Sink Package	•	•
1G	GEIL	GE22GB1066C5DC	5	GEIL	DS	Heat-Sink Package	•	•
1G	GEIL	GE24GB1066C5QC	5	GEIL	DS	Heat-Sink Package	•	•

Due to AMD CPU limitation, DDR2 1066 is supported by AM2+ CPU for one DIMM per channel only. Refer to www.asus.com for the supported CPU models.

DDR2-800 MHz capability

					SS/	DIMM support
Size	Vendor	Part No.	CL	Chip Brand		Chip No.	(Optional)
					DS	A*	B*	C*
1G	Kingston	KHX6400D2LL/1G	N/A	Kingston	DS	Heat-Sink Package	•	•
512MB	Kingston	KVR800D2N5/512	N/A	Promos	SS	V59C1512804QCF25SY032406PECPA	•	•
2G	Kingston	KHX6400D2/2G	N/A	Kingston	DS	Heat-Sink Package	•	•
4G	Kingston	N/A	N/A	Elpida	DS E2108ABSE-8G-E		•	•
512MB	Samsung	M378T6553GZS-CF7	6	Samsung	SS	K4T51083QG-HCF7	•	•
2G	Samsung	M37875663QZ3-CF7	6	Samsung	DS	K4T1G084QQ-HCF7	•	•
2G	Samsung	M391T5663QZ3-CF7	6	Samsung	DS	K4T1G084QQ-HCF7(ECC)	•	•
512MB	Qimonda	HYS64T64000EU-2.5-B2	6	Qimonda	SS	HYB18T512800B2F25FSS28380	•	•
1G	Micron	MT9HTF12872AY-800E1	6	Micron	SS	D9HNP 7YE22(ECC)	•	•
1G	Corsair	XMS2-6400	4	Corsair	DS	Heat-Sink Package	•	•
512MB	HY	HYMP564U64CP8-S5 AB	5	Hynix	SS	HY5PS12821CFP-S5	•	•
1G	HY	HYMP512U64CP8-S5 AB	5	Hynix	DS	HY5PS12821CFPS5	•	•
512MB	Kingmax	KLDC28F-A8KI5	N/A	Kingmax	SS KKA8FF1XF-JFS-25A		•	•
1G	Kingmax	KLDD48F-A8K15	N/A	Kingmax	DS KKA8FFIXF-HFS-25A		•	•
512MB	Apacer	78.91G91.9K5	5	Apacer	SS	AM4B5708JQJS8E0751C	•	•
2G	Apacer	78.A1GA0.9K4	5	Apacer	DS	AM4B5808CQJS8E0740E	•	•
512MB	Transcend	TS128MLQ64V8J512MB	N/A	Micron	SS	7HD22 D9GMH	•	•
1G	Transcend	505485-1034	5	Transcend	DS	TQ123PJF8F0801	•	•
512MB	VDATA	M2GVD6G3H3160Q1E52	N/A	VDATA	SS	VD29608A8A-25EG20813	•	•
1G	ADATA	M2OAD6G314170Q1E58	N/A	ADATA	DS	AD29608A8A-25EG80810	•	•
2G	PSC	AL8E8F73C-8E1	5	PSC	DS	A3R1GE3CFF734MAA0E	•	•
2G	PSC	AL7E8E63H-10E1K	5	PSC	DS	A3R1GE3CFF750RABBP(ECC)	•	•
1G	GEIL	GX22GB6400DC	5	GEIL	DS	Heat-Sink Package	•	•
2G	GEIL	GE28GB800C5QC	5	GEIL	DS	Heat-Sink Package	•	•
1G	Super Talent	T800UB1GC4	4	Super Talent	DS	Heat-Sink Package	•	•
1G	G.SKILL	F2-6400CL4D-2GBPK	4	G.SKILL	DS	Heat-Sink Package	•	•
2G	G.SKILL	F2-6400CL5D-4GBPQ	5	G.SKILL	DS	Heat-Sink Package	•	•
4G	G.SKILL	F2-6400CL5Q-16GNQ	5	G.SKILL	DS	Heat-Sink Package	•
1G	OCZ	OCZ2VU8004GK	6	OCZ	DS	Heat-Sink Package	•	•
1G	Elixir	M2Y1G64TU8HB0B-25C	5	Elixir	DS	N2TU51280BE-25C802006Z1DV	•	•

1-18 Chapter 1: Product introduction