Atmel ATA5577 Applications, Memory Mapping, Password Mode, Support Tools, Ordering Information

Applications
 Access Control ISO Cards, Key Fobs, and Coins
	Asset Management
	Animal Identifi cation
	(Supporting ISO 11784/11785 – FDX-B)
	– Livestock Tracking
	– Pigeon Racing Tags
	Waste Management
	ISO 11784/11785 (Non-Animal Mode)
	Laundry
	Manufacturing and Logistics
	– Material Handling
	– Recycling
	– Cylinder Tracking
Memory Mapping			0	1..............................................................32
		1	L	Analog Front End Option Setup	Block 3
			1	Traceabilty Data	Block 2
The EEPROM is made up of two pages. Page 0		Page
			1	Traceabilty Data	Block 1
consists of 8 blocks, including confi guration reg-
			L	Page 0 Confi guration Data	Block 0
ister and 32-bit password. Page 1 includes three
blocks of 32 bits each and contains the 64-bit			L	User Data or Password	Block 7
unique ID and the analog front end register. Each			L	User Data	Block 6
block can be protected against reprogramming via		0	L	User Data	Block 5
			L	User Data	Block 4
a lock bit.		Page
			L	User Data	Block 3
			L	User Data	Block 2
			L	User Data	Block 1
			L	Confi guration Data	Block 0

Password Mode	Support Tools
The memory of the ATA5577 can be protected	 Application Kits – ATAK2270, ATA2270-EK1
against unauthorized access. The password mode		Datasheet
provides write protection and – in combination with		Application Notes
the AOR feature – read protection.		Qual Packs

Ordering Information

Headquarters

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USA

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Japan

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Product Contact

Product Line

rfid@atmel.com

Literature Requests

www.atmel.com/literature

Web Site

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Part Number	On-Chip
	Cacity Value pF
ATA5577M#	ccc
	000 1)
ATA5577M1	075 1)
(Standard Pads)	250
	330
	000 1)
ATA5577M2	075 1)
(Mega Pads)	250
	330

1)On Request

Package	Description
-xxx
DDB	6" Sawn Wafer on Foil with Ring, Thickness 150 µm (Approx. 6 mil)
DBB	6" Sawn Wafer on Foil with Ring and NiAu Bumps 25 µm, Thickness 150 µm
	(Approx. 6 mil)
DDW 1)	6" Wafer, Thickness 280 µm (approx. 11 mil)
DDT 1)	Die in Waffl e Pack, Thickness 280 µm (Approx. 11 mil)
PAE 1)	NOA3 Micromodule (Lead-free)
DBB	6" Sawn Wafer on Foil with Ring and Au Bumps 25 µm, Thickness 150 µm
	(approx. 6 mil)
DDT 1)	Die in Waffl e Pack, Thickness 150 µm (Approx. 6 mil)

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Rev.: 4612B-RFID-03/08/00M

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