Dell 200 manual PowerApp systems offer the following major features

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The Dell™ PowerApp™ 200 appliance is an ultra-slim, full-featured, rack-mounted, turn-key device with an embedded operating system. Combined with innovative setup and administrative tools and utilities, the PowerApp 200 provides specific and reliable functionality in a rack-dense form factor.

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PowerApp systems offer the following major features:

￿One Intel® Pentium® III microprocessor.

The Pentium III microprocessor includes MMX™ technology designed to handle complex multimedia and communications software. This microprocessor incorporates new instructions and data types as well as a technique called single instruction, multiple data (SIMD) that allows the microprocessor to process multiple data elements in parallel, thereby improving overall system performance.

A secondary level 2 (L2) cache of static random-access memory (SRAM) is included within the single-edge contact (SEC) cartridge that contains the microprocessor. Math coprocessor functions are provided by the microprocessor. A separate and external math coprocessor chip is not used or required.

The size of the L2 cache is dependent on the processor installed in the system.

￿Front side bus (FSB) with an external bus speed of 133 megahertz (MHz).

￿A minimum of 512 megabytes (MB) of system memory, with a maximum of 2 gigabytes (GB) installed in combinations of 128-MB, 512-MB, 1-GB, or 2-GB regis- tered synchronous dynamic RAM (SDRAM) dual in-line memory modules (DIMMs) in the four DIMM sockets on the system board.

￿A basic input/output system (BIOS) that resides in flash memory on the Periph- eral Component Interconnect (PCI) bus.

￿Support for up to four 1-inch, hot-pluggable small computer system interface (SCSI) hard-disk drives. One additional 1-inch hard-disk drive can be installed in the optional removable media bay.

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