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Delta Electronics E48SR manual Electrical Characteristics Curves

Models: E48SR

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Figure 13: Output voltage noise and ripple measurement test setup

ELECTRICAL CHARACTERISTICS CURVES

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Figure 11: Input Terminal Ripple Current, ic, at full rated output current and nominal input voltage with 12µH source impedance and 33µF electrolytic capacitor (500 mA/div,2us/div)

Figure 12: Input reflected ripple current, is, through a 12µH source inductor at nominal input voltage and rated load current (20 mA/div,2us/div)

Vo(+)

Vo(-)

Copper Strip

10u	1u	SCOPE	RESISTIVE
			LOAD

Figure 13: Output voltage noise and ripple measurement test setup

DS_E48SR15004_05222008

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Delta Electronics E48SR manual Electrical Characteristics Curves, Output voltage noise and ripple measurement test setup

Contents

OPTIONS FEATURESDATASHEET DSE48SR1500405222008 APPLICATIONSOUTPUT CHARACTERISTICS TECHNICAL SPECIFICATIONSINPUT CHARACTERISTICS DYNAMIC CHARACTERISTICSELECTRICAL CHARACTERISTICS CURVES ELECTRICAL CHARACTERISTICS CURVES For Negative Remote On/Off LogicFor Positive Remote On/Off Logic Vin=48V.Top Trace Vout, 5V/div Bottom Trace ON/OFF inputELECTRICAL CHARACTERISTICS CURVES Figure 8 Output voltage response to step-change in load current 75%-50%-75% of Io, max di/dt = 0.1A/µs. Load cap 10µF tantalum capacitor and 1µF ceramic capacitor. Top Trace Vout 0.2V/div,200us/div, Bottom Trace Iout 1A/div. Scope measurement should be made using a BNC cable length shorter than 20 inches. Position the load between 51 mm to 76 mm 2 inches to 3 inches from the moduleELECTRICAL CHARACTERISTICS CURVES Figure 13 Output voltage noise and ripple measurement test setupELECTRICAL CHARACTERISTICS CURVES Load capacitance 1µF ceramic capacitor and 10µF tantalumDESIGN CONSIDERATIONS Safety ConsiderationsSoldering and Cleaning Considerations Input Source ImpedanceOver-Current Protection FEATURES DESCRIPTIONSOver-Temperature Protection Over-Voltage ProtectionEx. When Trim-down -10%15V×0.9=13.5V FEATURES DESCRIPTIONS CONOutput Voltage Adjustment TRIM Ex. When Trim-up +10%15 V×1.1=16.5VTHERMAL CURVES Thermal Testing SetupTHERMAL CONSIDERATIONS Thermal DeratingPICK AND PLACE LOCATION RECOMMENDED PAD LAYOUT SMDSURFACE-MOUNT TAPE & REEL Temp LEADED Sn/Pb PROCESS RECOMMEND TEMP. PROFILELEAD FREE SAC PROCESS RECOMMEND TEMP. PROFILE TimeThrough-hole module MECHANICAL DRAWINGSurface-mount module Pin NoWARRANTY PART NUMBERING SYSTEMMODEL LIST MODEL NAME