Components, parts and materials containing refractory ceramic fibers
Components, parts and materials containing radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
Tool Description
Automatic crossing screw driver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
Tool Size (if applicable)
Philip #1
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.Remove the Battery,and loosen screws on logic lower.
2.Get HDD, ODD and memory.
3.Remove KB,Pull out connecter.
4.Remove C cover
5.Pull out the DC IN cable, HDD connecter,ODD connecter,and USB Board cable,Remove Speaker cable from MB.
6.Loosen screw on WLAN and remove antenna.
7.Remove the MB,take down the thermal module and the CPU.
8.Remove LCD module, tear down LCD Cover.
9.Remove panel and camera
3.2Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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Template Revision B |
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