HP Server tc2110 manual

Memory technology evolution: an overview
of system memory technologies
technology brief, 8th edition
Abstract..............................................................................................................................................	2
Introduction.........................................................................................................................................	2
Basic DRAM operation .........................................................................................................................	2
DRAM storage density and power consumption ...................................................................................	4
Memory access time.........................................................................................................................	4
Chipsets and system bus timing..........................................................................................................	4
Memory bus speed...........................................................................................................................	5
Burst mode access............................................................................................................................	5
SDRAM technology..............................................................................................................................	6
Bank interleaving .............................................................................................................................	7
Increased bandwidth ........................................................................................................................	7
Registered SDRAM modules ..............................................................................................................	7
DIMM Configurations .......................................................................................................................	8
Single-sided and double-sided DIMMs ............................................................................................	8
Single-rank,dual-rank, and quad-rank DIMMs .................................................................................	8
Rank interleaving..........................................................................................................................	9
Memory channel interleaving ..........................................................................................................	10
Advanced memory technologies ..........................................................................................................	11
Double Data Rate SDRAM technologies ............................................................................................	11
DDR-1 .......................................................................................................................................	11
DDR-2 .......................................................................................................................................	13
DDR-3 .......................................................................................................................................	14
Module naming convention and peak bandwidth...........................................................................	14
Fully-Buffered DIMMs......................................................................................................................	15
FB-DIMM architecture..................................................................................................................	16
Challenges ................................................................................................................................	17
Rambus DRAM ..............................................................................................................................	18
Importance of using HP-certified memory modules in ProLiant servers .......................................................	19
Conclusion........................................................................................................................................	19
For more information..........................................................................................................................	20
Call to action ....................................................................................................................................	20