Product Overview

ICP-CM

 

 

1.4 Hardware .............................

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1.41

Block Diagram........................................................................................

1-11

Figure 1.41 Block Diagram ......................................................................................................

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1.42

Connector Location ...............................................................................

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Figure 1.42 Connector Locations ..............................................................................................

1-12

1.43

Connector Description ...........................................................................

1-12

Table 1.43 Connector Description ............................................................................................

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Table 1.43 Continued ...........................................................................................................

... 1-13

1.44

Front-Panel Features ...............................................................................

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Table 1.44 Front Panels ........................................................................................................

... 1-13

Figure 1.44 Front-Panel Options ..............................................................................................

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1.45

Interface Positions ..................................................................................

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Figure 1.45 Interfaces .........................................................................................................

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1.46

Construction - 4HP Standard CPU ..........................................................

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Figure 1.46 Construction of CPU with Heat-Sink Assembly ........................................................

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1.47

Construction - 8HP Standard CPU ..........................................................

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Figure 1.47 Construction of CPU with Heat-Sink Assembly ........................................................

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1.48

Construction - 8HP Standard CPU with AGP ...........................................

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Figure 1.48 Construction of CPU with Heat-Sink Assembly ........................................................

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1.49

Power Requirements ..............................................................................

1-19

Table 1.49 ICP-CM Power Reqirements ....................................................................................

1-19

1.50

Power Consumption ..............................................................................

1-20

Figure 1.50 ICP-CM Power Consumption ..................................................................................

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1.51

Thermal Considerations .........................................................................

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Table 1.51 ICP-CM Airflow Requirements .................................................................................

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