Product Overview
ICP-CM
1.4 Hardware .............................
1-11
1.41
Block Diagram........................................................................................
Figure 1.41 Block Diagram ......................................................................................................
. 1-11
1.42
Connector Location ...............................................................................
1-12
Figure 1.42 Connector Locations ..............................................................................................
1.43
Connector Description ...........................................................................
Table 1.43 Connector Description ............................................................................................
Table 1.43 Continued ...........................................................................................................
... 1-13
1.44
Front-Panel Features ...............................................................................
1-13
Table 1.44 Front Panels ........................................................................................................
Figure 1.44 Front-Panel Options ..............................................................................................
1-14
1.45
Interface Positions ..................................................................................
1-15
Figure 1.45 Interfaces .........................................................................................................
..... 1-15
1.46
Construction - 4HP Standard CPU ..........................................................
1-16
Figure 1.46 Construction of CPU with Heat-Sink Assembly ........................................................
1.47
Construction - 8HP Standard CPU ..........................................................
1-17
Figure 1.47 Construction of CPU with Heat-Sink Assembly ........................................................
1.48
Construction - 8HP Standard CPU with AGP ...........................................
1-18
Figure 1.48 Construction of CPU with Heat-Sink Assembly ........................................................
1.49
Power Requirements ..............................................................................
1-19
Table 1.49 ICP-CM Power Reqirements ....................................................................................
1.50
Power Consumption ..............................................................................
1-20
Figure 1.50 ICP-CM Power Consumption ..................................................................................
1.51
Thermal Considerations .........................................................................
1-21
Table 1.51 ICP-CM Airflow Requirements .................................................................................
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