CH A P T E R 1 Intel Express 550F Routing Switch

 

Positioning and Installing the Switch

Allow adequate ventilation

The switch contains two fans to air-cool the internal circuitry. The air

 

is drawn in from the left of the unit and expelled through the outlet

 

grills on the right side and the rear.

 

To ensure correct airflow, leave 100 mm (4 inches) free space on both

 

sides and behind the switch. Do not allow the intake or outlet grills to

 

become blocked.

On a desktop

To install the switch in a desktop environment:

 

1 Find the four rubber feet in the pack that contains the rack

 

mounting kit.

 

2 Remove the backing strip from each of the four feet.

 

3 Attach the four rubber feet to the underside of the switch (to

 

ensure that the switch stands firmly).

 

4 Place the switch on a stable, flat surface.

 

5 Ensure that the air intake (on the left) and fan outlets (on the

 

right side and rear) are not blocked.

 

Warning The switch’s lifetime and operational reliability can

 

be seriously degraded by inadequate cooling.

Rack requirements

Install the switch in a standard rack in accordance with IEC 297 (or

 

similar); if the minimum outside measurements of the rack are 600 x

 

600 mm (23.5 x 23.5 inches), you must allow 190 mm (7.5 inches) of

 

space at the rear.

Mounting kit

The switch is delivered with a kit to attach it to a standard 19-inch

 

equipment rack (with side support rails). The kit contains two mount-

 

ing brackets and four screws (for attaching the brackets to the sides

 

of the switch).

Tools required for

In addition to the mounting kit, you need the following items to

positioning in a rack

mount the switch in a rack:

 

Standard 19-inch rack with side support rails.

 

3 mm screwdriver.

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Intel 550F manual Positioning and Installing the Switch

550F specifications

The Intel 550F is a powerful and versatile processor designed for high-performance computing applications. As part of Intel's family of processors, the 550F is engineered to deliver exceptional processing power, energy efficiency, and advanced features that cater to a wide range of computing needs.

One of the standout features of the Intel 550F is its architecture. Built on Intel's cutting-edge technology, the processor utilizes the 10nm SuperFin process technology, allowing for better transistor performance and energy efficiency. This results in higher clock speeds while consuming less power, making it suitable for data centers and enterprise-level applications.

The Intel 550F boasts multiple cores and threads, which enable it to handle multitasking and parallel processing with ease. This is particularly beneficial for applications that require extensive computational power, such as scientific simulations, financial modeling, and artificial intelligence workloads. The processor's ability to support a large number of simultaneous threads enhances its overall performance, ensuring that users can run demanding applications without experiencing slowdowns.

Another notable feature of the Intel 550F is its support for Intel Turbo Boost Technology. This technology automatically increases the processor's clock speed during high-demand tasks, allowing for improved performance when needed. Coupled with Intel's Hyper-Threading technology, the processor can efficiently manage multiple tasks, enhancing productivity and responsiveness.

In terms of memory support, the Intel 550F is compatible with DDR4 memory, enabling faster data access and improved overall system performance. The processor also supports ECC (Error-Correcting Code) memory, which is crucial for mission-critical applications that require high reliability and data integrity.

Security is another area where the Intel 550F excels. It features advanced security technologies such as Intel Software Guard Extensions (SGX), which provides a secure enclave for sensitive data and applications. This hardware-based security feature is essential for businesses concerned about data breaches and unauthorized access.

The Intel 550F is designed with scalability in mind, making it an ideal choice for servers and large-scale computing environments. Its thermal design power (TDP) is optimized to ensure efficient cooling solutions can be implemented, allowing systems to maintain performance under heavy workloads.

In summary, the Intel 550F stands out as a feature-rich processor that combines high performance, energy efficiency, and advanced security features. Its architecture, multitasking capabilities, memory support, and scalability make it an excellent choice for a wide range of computing applications, from enterprise-level solutions to high-performance computing environments. As technology continues to advance, the Intel 550F remains a solid option for those looking for reliability and performance.