Intel 945G, 945GC, 945GZ, 945P, 945PL Mechanical Drawings,

Mechanical Drawings

Thermal and Mechanical Design Guidelines 39

Figure 20. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Heatsink Assembly

()55.88

2.200[]

()33

1.299[]

()19

.748[]

()19

.748[]

NOTES:

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D

DATABASE FILE. ALL D IMEN SI O N S AN D TO LERANCES ON THIS

DRAWING TAKE PREC ED EN C E OVER SUPPLIED FILE AND ARE

APPLICABLE AT PART FREE, UNCONSTRAINED STATE UNLESS

INDICATED OTHERWISE .

2. FINISH: NONE

3. ALL SECONDARY UNIT DIMENSIONS ARE F OR REFERENCE ONLY. TOLERANCES

SHALL BE CAL C ULATED FROM PRIMARY UNI TS TO AVOID TRUNCATIO N ER R ORS.

4. ITEMS WITHOUT IN TEL PAR T NU MBER SH AL L BE MANAGED

AND PROCUR ED BY SUPP L I ER

5 .ASSEMBLY TO BE MARKED WITH INTEL P/ N APPR O X . W H ER E SH OWN.

6. ATTACH THERMAL INTERFACE MATERIAL WHERE SHO W N . REMO VABLE PROTECTIVE

BARRIER APPLIED O VER I N TERFACE MATERI AL.

0.25 [.009] A B C

Contents

Main Intel 945G/945GZ/945GC/ 945P/945PL Express Chipset Family Page Contents Figures Tables Revision History Page 1 Introduction 1.1 Terminology Term Description 1.2 Reference Documents Page 2 Product Specifications 2.1 Package Description 2.1.1 Non-Grid Array Package Ball Placement 2.2 Package Loading Specifications 2.3 Thermal Specifications 2.4 Thermal Design Power (TDP) 2.4.1 Methodology 2.4.1.1 Pre-Silicon 2.4.1.2 Post-Silicon 2.4.2 Application Power 3 Thermal Metrology 3.1 Case Temperature Measurements 3.1.1 Thermocouple Attach Methodology 3.2 Airflow Characterization Page Page 4 Reference Thermal Solution 4.1 Operating Environment 4.1.1 ATX Form Factor Operating Environment 4.1.2 Balanced Technology Extended (BTX) Form Factor Operating Environment 4.2 Mechanical Design Envelope 4.3 Thermal Solution Assembly Page Page 4.4 Environmental Reliability Requirements Enabled Suppliers Appendix A Enabled Suppliers monica_chih@ccic.com.tw Page Mechanical Drawings Appendix B Mechanical Drawings The following table lists the mechanical drawings available in this document. Page NORTH SCALE 8 DETAIL A EAST Mechanical Drawings DETAIL A SCALE 5 Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms Mechanical Drawings Figure 12. (G)MCH Reference Heatsink for ATX Platforms Sheet 1 Mechanical Drawings Figure 13. (G)MCH Reference Heatsink for ATX Platforms Sheet 2 Mechanical Drawings [] Mechanical Drawings Figure 15. (G)MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 1 Mechanical Drawings Figure 16. (G)MCH Reference Heatsink for ATX Platforms Ramp Retainer Sheet 2 Mechanical Drawings Figure 17. (G)MCH Reference Heatsink for ATX Platforms Wire Preload Clip Mechanical Drawings Figure 18. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms Mechanical Drawings Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms Clip Mechanical Drawings

Intel Mechanical Drawings,

Models: 945G 945GC 945GZ 945P 945PL