Intel® Desktop Board DX58SO2 Extreme Series

Technical Specifications

For ordering information, visit www.intel.com

For the most current product information, visit www.intel.com/go/idb or http://ark.intel.com

For specific CPU compatibility, visit http://processormatch.intel.com

Processor

Processor Support

•Intel® Core™ i7 processors in the LGA1366 package

•Intel® Turbo Boost Technology4

•Intel® Hyper-Threading Technology5

•Integrated Memory Controller with support for up to 48 GB7 of system memory DDR3 +16006 / 1333 / 1066 MHz SDRAM

•Intel® Fast Memory Access

•Supports Intel® 64 architecture9

Chipset

Intel® X58 Express Chipset

•Intel® 82X58 IOH with ICH10R

•Intel® Matrix Storage Manager (RAID 0, 1, 5, 10)

•Two SATA (6.0 Gb/s) ports and 6 SATA (3.0 Gb/s) ports

•Two eSATA (3.0 Gb/s) ports on the back panel

USB PORTS

Integrated Intel® ICH10R controller

•Six Hi-Speed USB 2.0 ports via back panel

•Six additional Hi-Speed USB 2.0 ports via three internal headers

•Two SuperSpeed USB 3.0 ports via NEC controller

System BIOS

•32 Mb Flash EEPROM with Intel® Platform Innovation Framework for EFI Plug and Play, IDE drive auto-configure

•Advanced configuration and power interface V3.0b, DMI 2.5

Intel® Rapid BIOS Boot

•Intel® Rapid BIOS Boot

•Intel® Express BIOS update support: BIOS update via new F7 function key

1 Warning: Altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications.

2The Intel® Core Utilities Bundle includes Intel® Integrator Assis- tant, Intel® Integrator Toolkit, Intel® Express Installer, and Intel®

Express BIOS Update.

3Intel® Extreme Tuning Utility is only compatible with Intel® Desk- top Boards based on the Intel® X38 Express Chipset and newer. Auto-tuning capabilities may not be available for all Extreme Series motherboards.

4Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technol- ogy performance varies depending on hardware, software, and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information.

5Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technol- ogy-enabled chipset, BIOS, and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading.

Hardware Management Features

•Processor fan speed control

•System chassis fan speed control

•Voltage and temperature sensing

•Fan sensor inputs used to monitor fan activity

•Power management support for ACPI 3.0b

Intel® PRO 10/100/1000 Network Connection

•Dual LAN on the back panel

•New low-power design can meet Energy Star* 5.0 specifications

Expansion Capabilities

•Three PCI Express* 2.0 x16 connectors (configured as x16 / x8 / x8 in triple-graphics mode)

•Two PCI Express 2.0 x1 connectors

•One PCI connector

Audio

•10-channel Intel® High Definition Audio8 codec

•8-channel via the back panel

•2-channel via the front panel

•Back panel support for output via optical cable

•One internal header for S/PDIF output for HDMI* support

System Memory

Memory Capacity

•Six 240-pin DIMM connectors supporting triple- channel memory. Two double-sided DIMMs per channel.

•Maximum system memory up to 48 GB7 using 8 GB double-sided DIMMs

6Maximum peak memory bandwidth requires three DDR3 modules to be populated in each of the blue memory slots. DDR3 1600 memory support on this motherboard requires advanced knowl- edge of BIOS and memory tuning; individual results may vary. For specific supported memory for this motherboard, please visit www.intel.com/products/motherboard/ for more details.

7System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce avail- able addressable system memory. This could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.

8Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm

964-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://developer.intel.com/technology/intel64/index.htm for more information.

Memory Types

•DDR3 +1600 / 1333 / 1066 SDRAM memory support

•Non-ECC Memory

Memory Modes

• Triple-, dual-, or single-channel operation support

Memory Voltage

•1.35 V low voltage

•1.5 V standard JEDEC voltage

•Support for Intel® XMP extended voltage profiles

Jumpers and Front-Panel Connectors

Jumpers

•Single configuration jumper design

•Jumper access for BIOS maintenance mode

Front-Panel Connectors

•Reset, HD LED, Power LEDs, power on/off

•Three front-panel Hi-Speed USB 2.0 headers

•Front-panel audio header

•One IEEE 1394a header

Mechanical

Board Style

• ATX

Board Size

• 9.6” x 11.6” (24.38 cm x 29.46 cm)

Baseboard Power Requirements

• ATX 12 V

Environment

Operating Temperature

• 0° C to +55° C

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Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.

Actual Intel® Desktop Board may differ from the image shown.

Intel, the Intel logo, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Copyright © 2010 Intel Corporation. All rights reserved. 1110/JB/MS/PDF 324568-001US

Storage Temperature

• -20° C to +70° C

Regulations and Safety Standards

United States and Canada

UL 1950, Third edition—CAN/CSA C22.2

No. 950-95 with recognized U.S. and Canadian component marks

Europe

Nemko certified to EN 60950 International Nemko certified to IEC 60950

(CB report with CB certificate)

EMC regulations (tested in representative chassis) United States

FCC Part 15, Class B

FCC Part 15, Class B open-chassis (cover off) testing

Canada ICES-003, Class B

Europe

EMC directive 89/336/EEC; EN 55022:1998 Class B; EN 55024:1998

Australia/New Zealand

AS/NZS 3548, Class B

Taiwan

CNS 13438, Class B International CISPR 22:1997, Class B

Power requirements vary. Complies with US CRF via EN55022 +6 db in system configurations with an open chassis and EU Directive 89/336/EEC and use via EN55022 and EN50082-1 in a representative chassis.

Lead-Free: The symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration

level in any of the raw materials and the end product is not greater than 0.1% by weight (1000 ppm). This symbol is also used to indicate conformance to lead-free requirements and definitions adopted under the European Union’s Restriction on Hazardous Substances (RoHS) directive, 2002/95/EC.