Intel® Desktop Board DZ75ML-45K

Technical Specifications

Processor

Processor Support

• Optimized for Intel® -K processors. Supports 2nd and 3rd Generation Intel® Core™, and other Intel® processors in the LGA1155 package

Chipset

Intel® Z75 Express Chipset

 •

Intel® Z75 PCH

 •

Intel® Rapid Storage Manager (RAID 0, 1, 5, 10)

Peripheral Connectivity

 •

Two SATA 6.0 Gb/s ports

 •

Four SATA 3.0 Gb/s ports

 •

Four SuperSpeed USB 3.0 ports with 5.0 Gb/s link speed

 

(two back panel and two via internal headers)

 •

Ten Hi-Speed USB 2.0 ports (four back panel ports

 

and six ports via internal headers)

System BIOS

 •

64 Mb Flash EEPROM with Intel® Platform

 •

Innovation Framework for EFI Plug and Play

 •

Advanced configuration and power interface

 •

V3.0b, SMBIOS2.5

 •

Intel® Express BIOS update support

Hardware Management Features

 •

Processor fan speed control

 •

Front and rear system chassis fan speed control

 •

Voltage and temperature sensing

 •

Fan sensor inputs used to monitor fan activity

 •

ACPI-compliant power management support

Intel® PRO 10/100/1000 Network Connection  • Low-power design

1Warning: Altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications.

2Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.

See www.intel.com/technology/turboboost for more information.

3Intel® Hyper-Threading Technology requires a computer system with a procesor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating­ system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading.

4Maximum peak memory bandwidth requires four DDR 3 modules to be populated in each of the blue memory slots. DDR 3 2400 memory support on this

motherboard­requires advanced knowledge of BIOS and memory tuning; individual­

results may vary. For specific supported memory for this motherboard, please visit www.intel.com/products/motherboard/ for more details.

Expansion Capabilities

 •

One PCI Express* 3.0 x16 connector

 •

One PCI Express* 2.0 x16 connector (x4 Electrical)

 •

Two PCI Express* 2.0 x1 connector

Audio

 •

5.1 + 2 Intel® High Definition Audio 5

 •

Three stack analog audio ports plus internal S/PDIF

 

headers

Video

 • HDMI* and DVI-I Video connectors for Intel® processors with Intel® HD Graphics

System Memory

Memory Capacity

 •

Four 240-pin DIMM connectors supporting up to four

 

double-sided DIMMs

 •

Maximum system memory up to 32 GB 6 using 8 GB

 

doublesided DIMMs

Memory Types

 •

DDR3 2400MHz + O.C. SDRAM memory support

 •

Non-ECC Memory

 •

Dual- or single-channel operation support

Memory Voltage

 •

Memory voltage control from 1.2 V to 1.8 V

 •

1.5 V standard JEDEC voltage

Jumpers and Front Panel Connectors

Jumpers

 •

Jumper access for BIOS maintenance mode

Front Panel Connectors

 •

Reset, HD LED, Power LEDs, power on/off

 •

Front-panel audio header

Other Connectors

 •

Chassis intrusion detect header

5Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.html.

6System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Mechanical

Board Style

 •

microATX

Board Size

 •

9.6” x 9.6” (24.38 cm x 24.38 cm)

Baseboard Power Requirements

 •

ATX 12 V

Environment

Operating Temperature

 •

0° C to +55° C

Storage Temperature

 •

–20° C to +70° C

Regulations and Safety Standards

United States

UL 60950-1

Canada

CAN/CSA-C22.2 No. 60950-1

Europe

(Low Voltage Directive 2006/95/EC)

EN 60950-1

International

IEC 60950-1

Intel products are not intended for use in medical, life-saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

All products, dates, and figures specified are preliminary based on current expec- tations, and are subject to change without notice. Availability in different channels may vary.

Actual Intel® Desktop Board may differ from the image shown.

*Other names and brands may be claimed as the property of others. Copyright© 2012 Intel Corporation 09/12/FB/MED/PDF 327986-001US

EMC Regulations (Class B)

United States

FCC CFR Title 47, Chapter I, Part 15, Subparts A/B Canada

ICES-003

Europe

(EMC Directive 2004/108/EC) EN 55022 and EN 55024

Australia/New Zealand

EN 55022

Japan

VCCI V-3, V-4

South Korea

KN-22 and KN-24

Taiwan

CNS 13438

International

CISPR 22

Environmental Compliance

Europe

Europe RoHS (Directive 2002/95/EC)

WEEE (Directive 2002/96/EC)

China

China RoHS

For ordering information, visit www.intel.com

For the most current product information, visit www.intel.com/go/idb