Intel® Desktop Boards DH55HC and DH55TC Media Series Technical Specifications
Processor
Processor Support
•Intel® Core™ i7, Intel® Core™ i5, Intel® Core™ i3, and Intel® Pentium® processors in the LGA1156 package
•Supports Intel® 64 architecture7
Chipset
Intel® H55 Express Chipset
• Intel® 82H55 Platform Controller Hub (PCH)
Peripheral Connectivity
•Six SATA ports (3.0 Gb/s) with two SATA ports compatible with eSATA dongle
•Twelve
System BIOS
•64 Mb Flash EEPROM with Intel® Platform Innovation Framework for EFI Plug and Play
•Advanced configuration and power interface V3.0b, DMI 2.5
•Intel® Express BIOS update support
Hardware Management Features
•Processor fan speed control
•Front and rear system chassis fan speed control
•Voltage and temperature sensing
•Fan sensor inputs used to monitor fan activity
•ACPI-compliant power management support
Intel® PRO 10/100/1000 Network Connection
• New low-power design
Expansion Capabilities
•One PCI Express* 2.0 x16 connector
•Two PCI Express 2.0 x1 connectors
•Three PCI connectors (DH55HC)
•One PCI connector (DH55TC)
Audio
•5.1 + 2 multistreaming Intel® High Definition Audio5
•Internal S/PDIF header and speaker headers
Video
•VGA +
System Memory
Memory Capacity
•Four 240-pin DIMM connectors supporting up to four double-sided DIMMs
•Maximum system memory up to 16 GB4 using 4 GB double-sided DIMMs
Memory Types
•DDR3 1333 / 1066 SDRAM memory support
•Non-ECC Memory
•Supports memory overvoltage (DH55TC) and memory overclocking6
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
•Memory overvoltage to 1.60 V and 1.65 V (DH55HC)
•1.5 V standard JEDEC voltage
Jumpers and Front-Panel Connectors
Jumpers
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
•Reset, HD LED, Power LEDs, power on/off
•Front-panel audio header
Other Connectors
•One serial port header
•One parallel port header
•Chassis Intrusion Detect header (DH55HC)
Mechanical
Form Factor
•ATX (DH55HC)
•MicroATX (DH55TC)
Board Size
•9.6” x 11.6” (24.38 cm x 29.46 cm) (DH55HC)
•9.6” x 9.6” (24.38 cm x 24.38 cm) (DH55TC)
Baseboard Power Requirements
• ATX 12 V
Environment
Operating Temperature
• 0° C to +40° C
Storage Temperature
• -40° C to +60° C
Regulations and Safety Standards
United States and Canada
CSA/UL
Europe
(Low Voltage Directive 2006/95/EC) EN 60950-1
International
IEC 60950-1
EMC regulations (tested in representative chassis) United States
FCC 47 CFR Part 15, Subpart B
Canada ICES-003 Class B
Europe
(EMC Directive 2004/108/EC) EN 55022 and EN 55024
Australia/New Zealand
EN 55022 Class B
Japan
VCCI V-3, V-4 Class B
South Korea
KN-22 and KN-24
Taiwan
CNS 13438 Class B
International
CISPR 22 Class B
Environmental Compliance
Europe
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
1Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information.
2Intel®
3Requires a processor with Intel® HD Graphics.
4System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.
5Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm.
6WARNING: Altering PC memory frequency, voltage, and/or latency may: (i) reduce system stability and useful life of the system, memory, and processor; (ii) cause the processor and other system compo- nents to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the memory beyond its specifications. Intel assumes no responsibility that the memory, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with memory manufacturer for warranty and additional details.
7
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