Intel® Desktop Board DH61BF
Technical Specifications
Processor | Memory Modes | Mechanical | EMC Regulations (tested in representative chassis) | |
Processor Support | • Dual- or | Board Style | United States | |
• Supports 2nd and |
| • | MicroATX | FCC 47 CFR Part 15, Subpart B |
and Intel® Celeron® processors in the LGA1155 package | Hardware Management Features | Board Size | Canada | |
• Supports Intel® | • Processor fan speed control | • 8.86” × 7.48” (22.5 cm × 19 cm) | ||
Chipset | • System chassis fan speed control | Baseboard Power Requirements | Europe | |
• Voltage and temperature sensing | • | ATX 12 V | (EMC Directive 2004/108/EC) | |
Intel® H61 Express Chipset | • Fan sensor inputs used to monitor fan activity |
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| EN 55022 and EN 55024 |
• Intel® 82H61 Platform Controller Hub (PCH) | • | Environment | Australia / New Zealand | |
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| Operating Temperature | EN 55022 Class B | |
Peripheral Connectivity | Expansion Capabilities | • | 0° C to +55° C | Japan |
• Four SATA (3.0 Gb/s) ports | • Two PCI Express* ×1 bus | Storage Temperature | VCCI | |
• Integrated 10/100/1000 Network Connection | • One PCI Express 3.0 ×16 graphics connector | • | South Korea | |
• Eight |
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and four additional ports via internal headers) | Headers | Regulations and Safety Standards | Taiwan | |
| • One serial port header | CNS 13438 Class B | ||
System BIOS | Audio | United States and Canada | International | |
• 32 Mb Flash EEPROM with Intel® Platform Innovation |
| CSA/UL | CISPR 22 Class B | |
Framework for EFI Plug and Play | • | Europe | Environmental Compliance | |
• Advanced configuration and power interface V3.0b, |
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| (Low Voltage Directive 2006/95/EC) | |
SMBIOS2.5 | Jumpers and |
| EN | Europe |
• Intel® Express BIOS update support | Jumpers | International | Europe RoHS (Directive 2002/95/EC) | |
System Memory | • Single configuration jumper design |
| IEC | China |
• Jumper access for BIOS maintenance mode |
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| China RoHS (MII Order # 39) | |
Memory Capacity |
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• Two | • Reset, HDD LED, Power LEDs, power on/off |
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Memory Types | • |
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• DDR3 1333 4 /1066/800 SDRAM memory support |
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1.Intel® Turbo Boost Technology – maximum
2.Intel®
3.The Intel® Core Utilities bundle includes Intel® Integrator Assistant, Intel® Integrator Toolkit, Intel® Express Installer and Intel® Express Bios Update.
4.WARNING: Altering PC memory frequency, voltage and/or latency may: (i) reduce system stability and useful life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the memory beyond its specifications. Intel assumes no responsibility that the memory, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with memory manufacturer for warranty and additional details.
5.System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.
6.Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm.
7.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical,
All products, dates, and figures specified are preliminary based on current expec- tations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
* Other names and brands may be claimed as the property of others.
**Supports 95 W Thermal Design Power, Intel® Core™ Processors. For information, visit http://processormatch.intel.com
Copyright © 2012 Intel Corporation. All rights reserved. 11/12/FB/MED/PDF
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www.intel.com
For the most current product information, visit: www.intel.com/nextunitofcomputing