Intel® Desktop Board DQ77KB
Technical
Executive Series
PROCESSOR | MEMORY MODES | EMC REGULATIONS (tested in representative chassis) | ||||
Processor Support | • Dual- or | • Reset, HDD LED, power LEDs, power on/off | united States | |||
• Intel® Core™ i7 and Intel® Core™ i5 processors and other | MEMORY VOLTAGE | • | FCC 47 CFR Part 15, Subpart B | |||
• Intel® processors in the LGA1155 package. | • 1.2 V to 1.8 V | • | Canada | |||
• | Supports Intel® 64 architecture 4 | HARDWARE MANAGEMENT FEATURES | MECHANICAL BOARD STYLE | |||
CHIPSET | ||||||
• Processor fan speed control | • | Thin | Europe | |||
• Intel® Q77 express chipset | • System chassis fan speed control | BOARD SIZE | ||||
• Intel® Q77 Platform Controller Hub (PCH) | • Voltage and temperature sensing | (EMC Directive 2004 / 108 / EC) EN 55022 and EN 55024 | ||||
PERIPHERAL CONNECTIVITY | • Fan sensor inputs used to monitor fan activity | • 6.7” × 6.7” (17 cm × 17 cm) | Australia / New Zealand | |||
• | BASEBOARD POWER REQUIREMENTS | |||||
• 4 SATA ports (2 SATA 6.0 Gb/s; 2 SATA 3.0 Gb/s) |
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| EN 55022 Class B | |||
• Dual Integrated 10/100/1000 Network Connection | INTEL® PRO 10/100/1000 NETWORK CONNECTION | • Thin | Japan | |||
• 4 | • | ENVIRONMENT | ||||
• 5 |
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| VCCI | |||
SYSTEM BIOS | EXPANSION CAPABILITIES | OPERATING TEMPERATURE | South Korea | |||
• One PCI Express* 3.0 x4 connector | • 0° C to +55° C | |||||
• 96 Mb Flash EEPROM with Intel® Platform Innovation | • One | STORAGE TEMPERATURE | ||||
| Framework for EFI Plug and Play | • One | Taiwan | |||
• Advanced configuration and power interface V3.0b, SMBIOS 2.5 |
| wireless Intel® AMT | • | |||
• Intel® Express BIOS update support | HEADERS | REGULATIONS AND SAFETY STANDARDS | CNS 13438 Class B | |||
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SYSTEM MEMORY | • One serial port header | UNITED STATES AND CANADA | International | |||
Memory capacity | • | Custom Solutions header |
| CSA / UL | CISPR 22 Class B | |
• Two | • Digital microphone (DMIC) header |
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| SODIMMs (16 GB 5 max) | • | Stereo speaker header | EUROPE | ENVIRONMENTAL COMPLIANCE EUROPE | |
Memory Types | AUDIO |
| (Low Voltage Directive 2006 / 95 / EC) EN | Europe | ||
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| Europe RoHS (Directive 2002/95/EC) china | ||||
• DDR3 1600 6/ 1333 SDRAM memory support | • | INTERNATIONAL | China RoHS (MII Order # 39) | |||
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| IEC |
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JUMPERS AND
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
1Intel® Turbo Boost Technology – maximum
2Intel®
supporting HT Technology and an HT
3Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm
4
5System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.
6WARNING: Altering PC memory frequency, voltage and/or latency may: (i) reduce system stability and useful life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the memory beyond its specifications. Intel assumes no responsibility that the memory, including if used with altered clock frequencies and/or voltages, will be fit for any particular
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Intel products are not intended for use in medical,
Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
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Copyright© 2012, Intel Corporation 05/12/ST/MED/PDF